JPS52131167A - Multilayer circuit substrate - Google Patents

Multilayer circuit substrate

Info

Publication number
JPS52131167A
JPS52131167A JP4801876A JP4801876A JPS52131167A JP S52131167 A JPS52131167 A JP S52131167A JP 4801876 A JP4801876 A JP 4801876A JP 4801876 A JP4801876 A JP 4801876A JP S52131167 A JPS52131167 A JP S52131167A
Authority
JP
Japan
Prior art keywords
circuit substrate
multilayer circuit
multilayer
substrate
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4801876A
Other languages
English (en)
Inventor
Toshio Takahane
Nobuhiko Eguchi
Toshimasa Kobayashi
Shiyouji Nakakita
Masaji Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP4801876A priority Critical patent/JPS52131167A/ja
Priority to BR7702582A priority patent/BR7702582A/pt
Priority to FR7712449A priority patent/FR2349962A1/fr
Priority to CA276,908A priority patent/CA1088210A/en
Publication of JPS52131167A publication Critical patent/JPS52131167A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4685—Manufacturing of cross-over conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
JP4801876A 1976-04-26 1976-04-26 Multilayer circuit substrate Pending JPS52131167A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP4801876A JPS52131167A (en) 1976-04-26 1976-04-26 Multilayer circuit substrate
BR7702582A BR7702582A (pt) 1976-04-26 1977-04-25 Conjunto de substrato para um circuito eletronico possuindo flacoes com multiplas camadas,cada uma compreendendo filme metalico de fiacao
FR7712449A FR2349962A1 (fr) 1976-04-26 1977-04-25 Montage sur substrat pour circuit electronique comportant plusieurs couches de connexion
CA276,908A CA1088210A (en) 1976-04-26 1977-04-25 Substrate assembly for an electronic circuit having multilayered wirings, each comprising thin titanium and nickel base films for a wiring metal film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4801876A JPS52131167A (en) 1976-04-26 1976-04-26 Multilayer circuit substrate

Publications (1)

Publication Number Publication Date
JPS52131167A true JPS52131167A (en) 1977-11-02

Family

ID=12791559

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4801876A Pending JPS52131167A (en) 1976-04-26 1976-04-26 Multilayer circuit substrate

Country Status (4)

Country Link
JP (1) JPS52131167A (ja)
BR (1) BR7702582A (ja)
CA (1) CA1088210A (ja)
FR (1) FR2349962A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6285496A (ja) * 1985-10-09 1987-04-18 三菱電機株式会社 回路基板の製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2721435B1 (fr) * 1994-06-17 1996-08-02 Asulab Sa Microcontacteur magnétique et son procédé de fabrication.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6285496A (ja) * 1985-10-09 1987-04-18 三菱電機株式会社 回路基板の製造方法

Also Published As

Publication number Publication date
BR7702582A (pt) 1978-02-28
CA1088210A (en) 1980-10-21
FR2349962B1 (ja) 1982-02-19
FR2349962A1 (fr) 1977-11-25

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