JPS5213112B1 - - Google Patents
Info
- Publication number
- JPS5213112B1 JPS5213112B1 JP1775871A JP1775871A JPS5213112B1 JP S5213112 B1 JPS5213112 B1 JP S5213112B1 JP 1775871 A JP1775871 A JP 1775871A JP 1775871 A JP1775871 A JP 1775871A JP S5213112 B1 JPS5213112 B1 JP S5213112B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1775871A JPS5213112B1 (zh) | 1971-03-27 | 1971-03-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1775871A JPS5213112B1 (zh) | 1971-03-27 | 1971-03-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5213112B1 true JPS5213112B1 (zh) | 1977-04-12 |
Family
ID=11952613
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1775871A Pending JPS5213112B1 (zh) | 1971-03-27 | 1971-03-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5213112B1 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10981251B2 (en) | 2016-06-08 | 2021-04-20 | Han's Laser Technology Industry Group Co., Ltd | Method and device for cutting sapphire |
US11004743B2 (en) | 2017-03-23 | 2021-05-11 | Kioxia Corporation | Dicing method and laser processing apparatus |
-
1971
- 1971-03-27 JP JP1775871A patent/JPS5213112B1/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10981251B2 (en) | 2016-06-08 | 2021-04-20 | Han's Laser Technology Industry Group Co., Ltd | Method and device for cutting sapphire |
US11004743B2 (en) | 2017-03-23 | 2021-05-11 | Kioxia Corporation | Dicing method and laser processing apparatus |