JPS52130677U - - Google Patents

Info

Publication number
JPS52130677U
JPS52130677U JP1976038987U JP3898776U JPS52130677U JP S52130677 U JPS52130677 U JP S52130677U JP 1976038987 U JP1976038987 U JP 1976038987U JP 3898776 U JP3898776 U JP 3898776U JP S52130677 U JPS52130677 U JP S52130677U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1976038987U
Other languages
Japanese (ja)
Other versions
JPS6116701Y2 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1976038987U priority Critical patent/JPS6116701Y2/ja
Priority to DE2714145A priority patent/DE2714145C2/de
Priority to CA275,206A priority patent/CA1079868A/en
Publication of JPS52130677U publication Critical patent/JPS52130677U/ja
Priority to US06/011,639 priority patent/US4283838A/en
Priority to CA344,749A priority patent/CA1108773A/en
Application granted granted Critical
Publication of JPS6116701Y2 publication Critical patent/JPS6116701Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/30Die-attach connectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
JP1976038987U 1976-03-31 1976-03-31 Expired JPS6116701Y2 (https=)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP1976038987U JPS6116701Y2 (https=) 1976-03-31 1976-03-31
DE2714145A DE2714145C2 (de) 1976-03-31 1977-03-30 Gestanzte Metallträgerplatte für die Herstellung von kunststoffummantelten Halbleiterbauelementen
CA275,206A CA1079868A (en) 1976-03-31 1977-03-31 Plastic encapsulated semiconductor devices and method of making same
US06/011,639 US4283838A (en) 1976-03-31 1979-02-12 Method of making plastic encapsulated semiconductor devices
CA344,749A CA1108773A (en) 1976-03-31 1980-01-30 Plastic encapsulated semiconductor devices and method of making the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1976038987U JPS6116701Y2 (https=) 1976-03-31 1976-03-31

Publications (2)

Publication Number Publication Date
JPS52130677U true JPS52130677U (https=) 1977-10-04
JPS6116701Y2 JPS6116701Y2 (https=) 1986-05-22

Family

ID=28498161

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1976038987U Expired JPS6116701Y2 (https=) 1976-03-31 1976-03-31

Country Status (1)

Country Link
JP (1) JPS6116701Y2 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4988476A (https=) * 1972-12-26 1974-08-23

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4988476A (https=) * 1972-12-26 1974-08-23

Also Published As

Publication number Publication date
JPS6116701Y2 (https=) 1986-05-22

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