JPS52130677U - - Google Patents
Info
- Publication number
- JPS52130677U JPS52130677U JP3898776U JP3898776U JPS52130677U JP S52130677 U JPS52130677 U JP S52130677U JP 3898776 U JP3898776 U JP 3898776U JP 3898776 U JP3898776 U JP 3898776U JP S52130677 U JPS52130677 U JP S52130677U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976038987U JPS6116701Y2 (cg-RX-API-DMAC7.html) | 1976-03-31 | 1976-03-31 | |
| DE2714145A DE2714145C2 (de) | 1976-03-31 | 1977-03-30 | Gestanzte Metallträgerplatte für die Herstellung von kunststoffummantelten Halbleiterbauelementen |
| CA275,206A CA1079868A (en) | 1976-03-31 | 1977-03-31 | Plastic encapsulated semiconductor devices and method of making same |
| US06/011,639 US4283838A (en) | 1976-03-31 | 1979-02-12 | Method of making plastic encapsulated semiconductor devices |
| CA344,749A CA1108773A (en) | 1976-03-31 | 1980-01-30 | Plastic encapsulated semiconductor devices and method of making the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976038987U JPS6116701Y2 (cg-RX-API-DMAC7.html) | 1976-03-31 | 1976-03-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS52130677U true JPS52130677U (cg-RX-API-DMAC7.html) | 1977-10-04 |
| JPS6116701Y2 JPS6116701Y2 (cg-RX-API-DMAC7.html) | 1986-05-22 |
Family
ID=28498161
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1976038987U Expired JPS6116701Y2 (cg-RX-API-DMAC7.html) | 1976-03-31 | 1976-03-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6116701Y2 (cg-RX-API-DMAC7.html) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4988476A (cg-RX-API-DMAC7.html) * | 1972-12-26 | 1974-08-23 |
-
1976
- 1976-03-31 JP JP1976038987U patent/JPS6116701Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4988476A (cg-RX-API-DMAC7.html) * | 1972-12-26 | 1974-08-23 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6116701Y2 (cg-RX-API-DMAC7.html) | 1986-05-22 |