JPS52121883A - Jet cutting method - Google Patents
Jet cutting methodInfo
- Publication number
- JPS52121883A JPS52121883A JP3849076A JP3849076A JPS52121883A JP S52121883 A JPS52121883 A JP S52121883A JP 3849076 A JP3849076 A JP 3849076A JP 3849076 A JP3849076 A JP 3849076A JP S52121883 A JPS52121883 A JP S52121883A
- Authority
- JP
- Japan
- Prior art keywords
- cutting method
- jet cutting
- work
- high pressure
- pressure liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
PURPOSE: To provide a cutting method to obtain a cutting face generating no work-affected zone by using high pressure liquid.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3849076A JPS52121883A (en) | 1976-04-06 | 1976-04-06 | Jet cutting method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3849076A JPS52121883A (en) | 1976-04-06 | 1976-04-06 | Jet cutting method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS52121883A true JPS52121883A (en) | 1977-10-13 |
Family
ID=12526693
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3849076A Pending JPS52121883A (en) | 1976-04-06 | 1976-04-06 | Jet cutting method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS52121883A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01310542A (en) * | 1988-04-01 | 1989-12-14 | Westinghouse Electric Corp <We> | Machine cutting silicon dendrite webb automatically |
JP2000223383A (en) * | 1999-02-02 | 2000-08-11 | Canon Inc | Separating device, separating method and manufacture of semiconductor substrate |
-
1976
- 1976-04-06 JP JP3849076A patent/JPS52121883A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01310542A (en) * | 1988-04-01 | 1989-12-14 | Westinghouse Electric Corp <We> | Machine cutting silicon dendrite webb automatically |
JP2000223383A (en) * | 1999-02-02 | 2000-08-11 | Canon Inc | Separating device, separating method and manufacture of semiconductor substrate |
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