JPS5212057B2 - - Google Patents
Info
- Publication number
- JPS5212057B2 JPS5212057B2 JP48035904A JP3590473A JPS5212057B2 JP S5212057 B2 JPS5212057 B2 JP S5212057B2 JP 48035904 A JP48035904 A JP 48035904A JP 3590473 A JP3590473 A JP 3590473A JP S5212057 B2 JPS5212057 B2 JP S5212057B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6302—Non-deposition formation processes
- H10P14/6304—Formation by oxidation, e.g. oxidation of the substrate
- H10P14/6306—Formation by oxidation, e.g. oxidation of the substrate of the semiconductor materials
- H10P14/6312—Formation by oxidation, e.g. oxidation of the substrate of the semiconductor materials of Group III-V semiconductors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6302—Non-deposition formation processes
- H10P14/6322—Formation by thermal treatments
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
- Formation Of Insulating Films (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US24887472A | 1972-05-01 | 1972-05-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4927167A JPS4927167A (en:Method) | 1974-03-11 |
| JPS5212057B2 true JPS5212057B2 (en:Method) | 1977-04-04 |
Family
ID=22941055
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP48035904A Expired JPS5212057B2 (en:Method) | 1972-05-01 | 1973-03-30 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US3776789A (en:Method) |
| JP (1) | JPS5212057B2 (en:Method) |
| CA (1) | CA980919A (en:Method) |
| DE (1) | DE2319286C3 (en:Method) |
| FR (1) | FR2182969B1 (en:Method) |
| GB (1) | GB1371188A (en:Method) |
| IT (1) | IT981200B (en:Method) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2413608C2 (de) * | 1974-03-21 | 1982-09-02 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren zum Herstellen eines Halbleiterbauelements |
| FR2454183A1 (fr) * | 1979-04-10 | 1980-11-07 | Jerphagnon Jean | Structure de type oxyde-semi-conducteur dans laquelle le semi-conducteur est un compose iii-v et procede de fabrication de cette structure |
| US7001827B2 (en) * | 2003-04-15 | 2006-02-21 | International Business Machines Corporation | Semiconductor wafer front side protection |
| JP2006059535A (ja) * | 2004-08-17 | 2006-03-02 | Seiko Instruments Inc | 有機電子デバイスの製造方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3342652A (en) * | 1964-04-02 | 1967-09-19 | Ibm | Chemical polishing of a semi-conductor substrate |
| CA920285A (en) * | 1970-11-30 | 1973-01-30 | L. Hartman Robert | Extending the operating life of light emitting p-n junction devices |
-
1972
- 1972-05-01 US US00248874A patent/US3776789A/en not_active Expired - Lifetime
-
1973
- 1973-03-08 IT IT21310/73A patent/IT981200B/it active
- 1973-03-30 JP JP48035904A patent/JPS5212057B2/ja not_active Expired
- 1973-03-30 FR FR7313777A patent/FR2182969B1/fr not_active Expired
- 1973-04-13 CA CA169,274A patent/CA980919A/en not_active Expired
- 1973-04-17 DE DE2319286A patent/DE2319286C3/de not_active Expired
- 1973-04-18 GB GB1859073A patent/GB1371188A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| FR2182969A1 (en:Method) | 1973-12-14 |
| DE2319286C3 (de) | 1981-12-24 |
| FR2182969B1 (en:Method) | 1977-04-29 |
| JPS4927167A (en:Method) | 1974-03-11 |
| CA980919A (en) | 1975-12-30 |
| US3776789A (en) | 1973-12-04 |
| DE2319286B2 (de) | 1981-02-05 |
| GB1371188A (en) | 1974-10-23 |
| IT981200B (it) | 1974-10-10 |
| DE2319286A1 (de) | 1973-11-22 |