JPS52118600A - Resinous composition for liquiddinjection forming containing lowwexpansionnfactor glassspowder filling material - Google Patents
Resinous composition for liquiddinjection forming containing lowwexpansionnfactor glassspowder filling materialInfo
- Publication number
- JPS52118600A JPS52118600A JP3476477A JP3476477A JPS52118600A JP S52118600 A JPS52118600 A JP S52118600A JP 3476477 A JP3476477 A JP 3476477A JP 3476477 A JP3476477 A JP 3476477A JP S52118600 A JPS52118600 A JP S52118600A
- Authority
- JP
- Japan
- Prior art keywords
- lowwexpansionnfactor
- liquiddinjection
- glassspowder
- filling material
- resinous composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/002—Inhomogeneous material in general
- H01B3/006—Other inhomogeneous material
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Organic Insulating Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US05/671,853 US4038491A (en) | 1976-03-30 | 1976-03-30 | Fluid casting composition containing low expansion glass filler |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS52118600A true JPS52118600A (en) | 1977-10-05 |
| JPS5410118B2 JPS5410118B2 (OSRAM) | 1979-05-01 |
Family
ID=24696134
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3476477A Granted JPS52118600A (en) | 1976-03-30 | 1977-03-30 | Resinous composition for liquiddinjection forming containing lowwexpansionnfactor glassspowder filling material |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US4038491A (OSRAM) |
| JP (1) | JPS52118600A (OSRAM) |
| CA (1) | CA1100660A (OSRAM) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4358552A (en) * | 1981-09-10 | 1982-11-09 | Morton-Norwich Products, Inc. | Epoxy resinous molding compositions having low coefficient of thermal expansion and high thermal conductivity |
| JPS6042247A (ja) * | 1983-08-16 | 1985-03-06 | Asahi Glass Co Ltd | 低膨張性ガラス |
| KR930000791B1 (ko) * | 1989-11-09 | 1993-02-04 | 미쯔비시덴끼 가부시끼가이샤 | 편향 요크 |
| US5204649A (en) * | 1989-11-09 | 1993-04-20 | Mitsubishi Denki Kabushiki Kaisha | Deflection yoke |
| JP3588401B2 (ja) * | 1995-06-23 | 2004-11-10 | 三菱電機株式会社 | 絶縁スペーサ及びシールド電極の製造方法 |
| KR20010002615A (ko) * | 1999-06-16 | 2001-01-15 | 이구택 | 고크롬함유 스테인레스강의 주조시 래들 주입구 막힘 방지용필러 |
| US20030048074A1 (en) * | 2001-09-12 | 2003-03-13 | Jui-Ming Ni | Method for packaging organic electroluminescent components with polymer passivation layer and structure thereof |
| CN101253582B (zh) * | 2005-06-07 | 2011-06-29 | Abb研究有限公司 | 套管、使用该套管的高压/中压设备及制造该套管的方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4930440A (OSRAM) * | 1972-07-20 | 1974-03-18 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB673596A (en) * | 1949-08-17 | 1952-06-11 | British Thomson Houston Co Ltd | Improvements in and relating to electric insulating bushings and glass therefor |
| BE638932A (OSRAM) * | 1962-10-26 | |||
| DE1496665A1 (de) * | 1964-11-18 | 1969-09-11 | Siemens Ag | Verwendung eines glaskeramischen Koerpers als Werkstoff fuer elektrische Widerstandskoerper |
| US3433893A (en) * | 1967-06-12 | 1969-03-18 | Westinghouse Electric Corp | Cast electrical bushing |
-
1976
- 1976-03-30 US US05/671,853 patent/US4038491A/en not_active Expired - Lifetime
-
1977
- 1977-03-08 CA CA273,482A patent/CA1100660A/en not_active Expired
- 1977-03-30 JP JP3476477A patent/JPS52118600A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4930440A (OSRAM) * | 1972-07-20 | 1974-03-18 |
Also Published As
| Publication number | Publication date |
|---|---|
| US4038491A (en) | 1977-07-26 |
| CA1100660A (en) | 1981-05-05 |
| JPS5410118B2 (OSRAM) | 1979-05-01 |
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