JPS5211792A - Carrier bonded with material block and method of producing same - Google Patents

Carrier bonded with material block and method of producing same

Info

Publication number
JPS5211792A
JPS5211792A JP51081870A JP8187076A JPS5211792A JP S5211792 A JPS5211792 A JP S5211792A JP 51081870 A JP51081870 A JP 51081870A JP 8187076 A JP8187076 A JP 8187076A JP S5211792 A JPS5211792 A JP S5211792A
Authority
JP
Japan
Prior art keywords
material block
producing same
carrier bonded
bonded
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP51081870A
Other languages
Japanese (ja)
Inventor
Zasu Boorufugangu
Yoshiyuko Giyuntaa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TED Bildplatten AG AEG Telefunken Teldec
Original Assignee
TED Bildplatten AG AEG Telefunken Teldec
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TED Bildplatten AG AEG Telefunken Teldec filed Critical TED Bildplatten AG AEG Telefunken Teldec
Publication of JPS5211792A publication Critical patent/JPS5211792A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
    • H10N30/088—Shaping or machining of piezoelectric or electrostrictive bodies by machining by cutting or dicing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
JP51081870A 1975-07-09 1976-07-09 Carrier bonded with material block and method of producing same Pending JPS5211792A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2530569A DE2530569C3 (en) 1975-07-09 1975-07-09 Carriers with glued-on blocks of material and manufacturing processes therefor

Publications (1)

Publication Number Publication Date
JPS5211792A true JPS5211792A (en) 1977-01-28

Family

ID=5951024

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51081870A Pending JPS5211792A (en) 1975-07-09 1976-07-09 Carrier bonded with material block and method of producing same

Country Status (2)

Country Link
JP (1) JPS5211792A (en)
DE (1) DE2530569C3 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3021449A1 (en) * 1980-06-06 1981-12-24 Siemens AG, 1000 Berlin und 8000 München ULTRASONIC TRANSDUCER ARRANGEMENT AND METHOD FOR THE PRODUCTION THEREOF
FR2520936A1 (en) * 1982-01-29 1983-08-05 Thomson Csf METHOD FOR THE COLLECTIVE MANUFACTURE OF PIEZOELECTRIC TRANSDUCERS, TRANSDUCERS OBTAINED BY THIS METHOD AND USE OF SUCH A METHOD
AU544464B2 (en) * 1982-12-27 1985-05-30 Tokyo Shibaura Denki Kabushiki Kaisha Ultrasonic transducer

Also Published As

Publication number Publication date
DE2530569A1 (en) 1977-01-13
DE2530569B2 (en) 1978-02-16
DE2530569C3 (en) 1978-10-19

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