JPS52116865A - Method of producing hybrid ic - Google Patents
Method of producing hybrid icInfo
- Publication number
- JPS52116865A JPS52116865A JP3252676A JP3252676A JPS52116865A JP S52116865 A JPS52116865 A JP S52116865A JP 3252676 A JP3252676 A JP 3252676A JP 3252676 A JP3252676 A JP 3252676A JP S52116865 A JPS52116865 A JP S52116865A
- Authority
- JP
- Japan
- Prior art keywords
- producing hybrid
- hybrid
- producing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3252676A JPS52116865A (en) | 1976-03-26 | 1976-03-26 | Method of producing hybrid ic |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3252676A JPS52116865A (en) | 1976-03-26 | 1976-03-26 | Method of producing hybrid ic |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS52116865A true JPS52116865A (en) | 1977-09-30 |
Family
ID=12361387
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3252676A Pending JPS52116865A (en) | 1976-03-26 | 1976-03-26 | Method of producing hybrid ic |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS52116865A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0696552A1 (en) | 1994-08-08 | 1996-02-14 | Kodak-Pathe | Process for treating photographic effluents using ultraviolet and hydrogen peroxide |
-
1976
- 1976-03-26 JP JP3252676A patent/JPS52116865A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0696552A1 (en) | 1994-08-08 | 1996-02-14 | Kodak-Pathe | Process for treating photographic effluents using ultraviolet and hydrogen peroxide |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS532091A (en) | Selffarraying method of producing ic | |
CS191329B2 (en) | Method of producing m-phenoxybenzaldehyde | |
JPS5343021A (en) | Method of producing molybdenummiron | |
JPS52119086A (en) | Method of forming ic | |
JPS5448487A (en) | Method of producing semiconductor | |
JPS5336391A (en) | Method of producing can | |
JPS5316866A (en) | Method of producing hybrid integrated circuit | |
JPS52116865A (en) | Method of producing hybrid ic | |
JPS5384165A (en) | Method of producing hyb ic | |
JPS5365973A (en) | Method of producing hyb ic | |
JPS5366568A (en) | Method of producing hyb ic | |
JPS54143871A (en) | Method of producing hybrid ic circuit | |
JPS52100172A (en) | Method of producing hybrid integrated circuit | |
JPS5384680A (en) | Method of producing semiconductor | |
JPS52140860A (en) | Method of producing hybrid integrated circuit | |
JPS52120084A (en) | Method of producing can | |
JPS5245057A (en) | Method of producing hybrid circuit | |
JPS5378229A (en) | Method of producing canthaxanthene | |
JPS52128380A (en) | Method of producing 22chloronicotinamides | |
JPS531860A (en) | Method of producing hybrid integrated circuit unit | |
JPS52137669A (en) | Method of producing hybrid integrated circuit unit | |
JPS5378067A (en) | Method of producing hyb ic | |
JPS5373361A (en) | Method of producing hyb ic | |
JPS52103676A (en) | Method of producing hybrid integrated circuit | |
JPS5380557A (en) | Method of producing hybrid integrated circuit |