JPS52116159U - - Google Patents

Info

Publication number
JPS52116159U
JPS52116159U JP1976024252U JP2425276U JPS52116159U JP S52116159 U JPS52116159 U JP S52116159U JP 1976024252 U JP1976024252 U JP 1976024252U JP 2425276 U JP2425276 U JP 2425276U JP S52116159 U JPS52116159 U JP S52116159U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1976024252U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1976024252U priority Critical patent/JPS52116159U/ja
Publication of JPS52116159U publication Critical patent/JPS52116159U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/90Bond pads, in general
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/90Bond pads, in general
    • H10W72/921Structures or relative sizes of bond pads
    • H10W72/922Bond pads being integral with underlying chip-level interconnections
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/90Bond pads, in general
    • H10W72/931Shapes of bond pads
    • H10W72/934Cross-sectional shape, i.e. in side view

Landscapes

  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP1976024252U 1976-03-01 1976-03-01 Pending JPS52116159U (ref)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1976024252U JPS52116159U (ref) 1976-03-01 1976-03-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1976024252U JPS52116159U (ref) 1976-03-01 1976-03-01

Publications (1)

Publication Number Publication Date
JPS52116159U true JPS52116159U (ref) 1977-09-03

Family

ID=28484141

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1976024252U Pending JPS52116159U (ref) 1976-03-01 1976-03-01

Country Status (1)

Country Link
JP (1) JPS52116159U (ref)

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