JPS52114658U - - Google Patents
Info
- Publication number
- JPS52114658U JPS52114658U JP1976022179U JP2217976U JPS52114658U JP S52114658 U JPS52114658 U JP S52114658U JP 1976022179 U JP1976022179 U JP 1976022179U JP 2217976 U JP2217976 U JP 2217976U JP S52114658 U JPS52114658 U JP S52114658U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976022179U JPS52114658U (enFirst) | 1976-02-25 | 1976-02-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976022179U JPS52114658U (enFirst) | 1976-02-25 | 1976-02-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS52114658U true JPS52114658U (enFirst) | 1977-08-31 |
Family
ID=28482142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1976022179U Pending JPS52114658U (enFirst) | 1976-02-25 | 1976-02-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS52114658U (enFirst) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4913113A (enFirst) * | 1972-06-02 | 1974-02-05 | ||
| JPS506153A (enFirst) * | 1973-05-19 | 1975-01-22 |
-
1976
- 1976-02-25 JP JP1976022179U patent/JPS52114658U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4913113A (enFirst) * | 1972-06-02 | 1974-02-05 | ||
| JPS506153A (enFirst) * | 1973-05-19 | 1975-01-22 |