JPS52114283A - Superhigh frequency diode device - Google Patents

Superhigh frequency diode device

Info

Publication number
JPS52114283A
JPS52114283A JP3106076A JP3106076A JPS52114283A JP S52114283 A JPS52114283 A JP S52114283A JP 3106076 A JP3106076 A JP 3106076A JP 3106076 A JP3106076 A JP 3106076A JP S52114283 A JPS52114283 A JP S52114283A
Authority
JP
Japan
Prior art keywords
superhigh frequency
diode device
frequency diode
lead wire
terminal bar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3106076A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5724932B2 (enrdf_load_html_response
Inventor
Masami Akaike
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP3106076A priority Critical patent/JPS52114283A/ja
Publication of JPS52114283A publication Critical patent/JPS52114283A/ja
Publication of JPS5724932B2 publication Critical patent/JPS5724932B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP3106076A 1976-03-22 1976-03-22 Superhigh frequency diode device Granted JPS52114283A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3106076A JPS52114283A (en) 1976-03-22 1976-03-22 Superhigh frequency diode device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3106076A JPS52114283A (en) 1976-03-22 1976-03-22 Superhigh frequency diode device

Publications (2)

Publication Number Publication Date
JPS52114283A true JPS52114283A (en) 1977-09-24
JPS5724932B2 JPS5724932B2 (enrdf_load_html_response) 1982-05-26

Family

ID=12320922

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3106076A Granted JPS52114283A (en) 1976-03-22 1976-03-22 Superhigh frequency diode device

Country Status (1)

Country Link
JP (1) JPS52114283A (enrdf_load_html_response)

Also Published As

Publication number Publication date
JPS5724932B2 (enrdf_load_html_response) 1982-05-26

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