JPS52109870A - Apparatus for wireebonding - Google Patents
Apparatus for wireebondingInfo
- Publication number
- JPS52109870A JPS52109870A JP2646076A JP2646076A JPS52109870A JP S52109870 A JPS52109870 A JP S52109870A JP 2646076 A JP2646076 A JP 2646076A JP 2646076 A JP2646076 A JP 2646076A JP S52109870 A JPS52109870 A JP S52109870A
- Authority
- JP
- Japan
- Prior art keywords
- wireebonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2646076A JPS52109870A (en) | 1976-03-11 | 1976-03-11 | Apparatus for wireebonding |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2646076A JPS52109870A (en) | 1976-03-11 | 1976-03-11 | Apparatus for wireebonding |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS52109870A true JPS52109870A (en) | 1977-09-14 |
JPS5742972B2 JPS5742972B2 (en) | 1982-09-11 |
Family
ID=12194110
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2646076A Granted JPS52109870A (en) | 1976-03-11 | 1976-03-11 | Apparatus for wireebonding |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS52109870A (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50157069A (en) * | 1974-06-07 | 1975-12-18 |
-
1976
- 1976-03-11 JP JP2646076A patent/JPS52109870A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50157069A (en) * | 1974-06-07 | 1975-12-18 |
Also Published As
Publication number | Publication date |
---|---|
JPS5742972B2 (en) | 1982-09-11 |
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