JPS52109870A - Apparatus for wireebonding - Google Patents

Apparatus for wireebonding

Info

Publication number
JPS52109870A
JPS52109870A JP2646076A JP2646076A JPS52109870A JP S52109870 A JPS52109870 A JP S52109870A JP 2646076 A JP2646076 A JP 2646076A JP 2646076 A JP2646076 A JP 2646076A JP S52109870 A JPS52109870 A JP S52109870A
Authority
JP
Japan
Prior art keywords
wireebonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2646076A
Other languages
Japanese (ja)
Other versions
JPS5742972B2 (en
Inventor
Nobuhito Yamazaki
Mitsuru Kiyouhara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Seisakusho Co Ltd
Priority to JP2646076A priority Critical patent/JPS52109870A/en
Publication of JPS52109870A publication Critical patent/JPS52109870A/en
Publication of JPS5742972B2 publication Critical patent/JPS5742972B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP2646076A 1976-03-11 1976-03-11 Apparatus for wireebonding Granted JPS52109870A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2646076A JPS52109870A (en) 1976-03-11 1976-03-11 Apparatus for wireebonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2646076A JPS52109870A (en) 1976-03-11 1976-03-11 Apparatus for wireebonding

Publications (2)

Publication Number Publication Date
JPS52109870A true JPS52109870A (en) 1977-09-14
JPS5742972B2 JPS5742972B2 (en) 1982-09-11

Family

ID=12194110

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2646076A Granted JPS52109870A (en) 1976-03-11 1976-03-11 Apparatus for wireebonding

Country Status (1)

Country Link
JP (1) JPS52109870A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50157069A (en) * 1974-06-07 1975-12-18

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50157069A (en) * 1974-06-07 1975-12-18

Also Published As

Publication number Publication date
JPS5742972B2 (en) 1982-09-11

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