JPS52109869A - Apparatus for wireebonding - Google Patents

Apparatus for wireebonding

Info

Publication number
JPS52109869A
JPS52109869A JP2645976A JP2645976A JPS52109869A JP S52109869 A JPS52109869 A JP S52109869A JP 2645976 A JP2645976 A JP 2645976A JP 2645976 A JP2645976 A JP 2645976A JP S52109869 A JPS52109869 A JP S52109869A
Authority
JP
Japan
Prior art keywords
wireebonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2645976A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5733852B2 (enrdf_load_stackoverflow
Inventor
Nobuhito Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Seisakusho Co Ltd
Priority to JP2645976A priority Critical patent/JPS52109869A/ja
Publication of JPS52109869A publication Critical patent/JPS52109869A/ja
Publication of JPS5733852B2 publication Critical patent/JPS5733852B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Wire Bonding (AREA)
JP2645976A 1976-03-11 1976-03-11 Apparatus for wireebonding Granted JPS52109869A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2645976A JPS52109869A (en) 1976-03-11 1976-03-11 Apparatus for wireebonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2645976A JPS52109869A (en) 1976-03-11 1976-03-11 Apparatus for wireebonding

Publications (2)

Publication Number Publication Date
JPS52109869A true JPS52109869A (en) 1977-09-14
JPS5733852B2 JPS5733852B2 (enrdf_load_stackoverflow) 1982-07-20

Family

ID=12194081

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2645976A Granted JPS52109869A (en) 1976-03-11 1976-03-11 Apparatus for wireebonding

Country Status (1)

Country Link
JP (1) JPS52109869A (enrdf_load_stackoverflow)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50157069A (enrdf_load_stackoverflow) * 1974-06-07 1975-12-18

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50157069A (enrdf_load_stackoverflow) * 1974-06-07 1975-12-18

Also Published As

Publication number Publication date
JPS5733852B2 (enrdf_load_stackoverflow) 1982-07-20

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