JPS5210770U - - Google Patents

Info

Publication number
JPS5210770U
JPS5210770U JP9650875U JP9650875U JPS5210770U JP S5210770 U JPS5210770 U JP S5210770U JP 9650875 U JP9650875 U JP 9650875U JP 9650875 U JP9650875 U JP 9650875U JP S5210770 U JPS5210770 U JP S5210770U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9650875U
Other languages
Japanese (ja)
Other versions
JPS5550997Y2 (enrdf_load_html_response
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9650875U priority Critical patent/JPS5550997Y2/ja
Publication of JPS5210770U publication Critical patent/JPS5210770U/ja
Application granted granted Critical
Publication of JPS5550997Y2 publication Critical patent/JPS5550997Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Wire Bonding (AREA)
JP9650875U 1975-07-10 1975-07-10 Expired JPS5550997Y2 (enrdf_load_html_response)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9650875U JPS5550997Y2 (enrdf_load_html_response) 1975-07-10 1975-07-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9650875U JPS5550997Y2 (enrdf_load_html_response) 1975-07-10 1975-07-10

Publications (2)

Publication Number Publication Date
JPS5210770U true JPS5210770U (enrdf_load_html_response) 1977-01-25
JPS5550997Y2 JPS5550997Y2 (enrdf_load_html_response) 1980-11-27

Family

ID=28578221

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9650875U Expired JPS5550997Y2 (enrdf_load_html_response) 1975-07-10 1975-07-10

Country Status (1)

Country Link
JP (1) JPS5550997Y2 (enrdf_load_html_response)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54111767A (en) * 1978-02-21 1979-09-01 Nec Corp Manufacture for semiconductor device
JPH01109320A (ja) * 1987-10-23 1989-04-26 Tanaka Sangyo:Kk めがねフレームとパッドの固着構造

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54111767A (en) * 1978-02-21 1979-09-01 Nec Corp Manufacture for semiconductor device
JPH01109320A (ja) * 1987-10-23 1989-04-26 Tanaka Sangyo:Kk めがねフレームとパッドの固着構造

Also Published As

Publication number Publication date
JPS5550997Y2 (enrdf_load_html_response) 1980-11-27

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