JPS52107090A - Stabilization of thermosetting resin during storage - Google Patents
Stabilization of thermosetting resin during storageInfo
- Publication number
- JPS52107090A JPS52107090A JP1885176A JP1885176A JPS52107090A JP S52107090 A JPS52107090 A JP S52107090A JP 1885176 A JP1885176 A JP 1885176A JP 1885176 A JP1885176 A JP 1885176A JP S52107090 A JPS52107090 A JP S52107090A
- Authority
- JP
- Japan
- Prior art keywords
- thermosetting resin
- stabilization
- during storage
- resin during
- storage stability
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: The addition of a compound containing a specific living radical improves the storage stability of an anaerobic thermosetting resin comprising an epoxyester resin dissolved in polymerizable unsaturated monomers.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1885176A JPS52107090A (en) | 1976-02-25 | 1976-02-25 | Stabilization of thermosetting resin during storage |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1885176A JPS52107090A (en) | 1976-02-25 | 1976-02-25 | Stabilization of thermosetting resin during storage |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS52107090A true JPS52107090A (en) | 1977-09-08 |
Family
ID=11983041
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1885176A Pending JPS52107090A (en) | 1976-02-25 | 1976-02-25 | Stabilization of thermosetting resin during storage |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS52107090A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09194515A (en) * | 1996-01-12 | 1997-07-29 | Ivoclar Ag | Photosetting composite material |
EP0924247A1 (en) * | 1997-12-23 | 1999-06-23 | Nippon Shokubai Co., Ltd. | Thermosetting resin composition and producing process thereof |
US6265469B1 (en) * | 1999-09-02 | 2001-07-24 | Du Pont Wirex Ltd | Epoxy resin adhesive for flexible printed circuits |
-
1976
- 1976-02-25 JP JP1885176A patent/JPS52107090A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09194515A (en) * | 1996-01-12 | 1997-07-29 | Ivoclar Ag | Photosetting composite material |
EP0924247A1 (en) * | 1997-12-23 | 1999-06-23 | Nippon Shokubai Co., Ltd. | Thermosetting resin composition and producing process thereof |
US6265469B1 (en) * | 1999-09-02 | 2001-07-24 | Du Pont Wirex Ltd | Epoxy resin adhesive for flexible printed circuits |
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