JPS52100174A - Method and device for mounting solder wire - Google Patents

Method and device for mounting solder wire

Info

Publication number
JPS52100174A
JPS52100174A JP1728576A JP1728576A JPS52100174A JP S52100174 A JPS52100174 A JP S52100174A JP 1728576 A JP1728576 A JP 1728576A JP 1728576 A JP1728576 A JP 1728576A JP S52100174 A JPS52100174 A JP S52100174A
Authority
JP
Japan
Prior art keywords
solder wire
mounting solder
mounting
wire
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1728576A
Other languages
Japanese (ja)
Other versions
JPS5724680B2 (en
Inventor
Akira Imada
Mikio Yasuda
Seiichi Sawada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP1728576A priority Critical patent/JPS52100174A/en
Publication of JPS52100174A publication Critical patent/JPS52100174A/en
Publication of JPS5724680B2 publication Critical patent/JPS5724680B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Electrical Connectors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP1728576A 1976-02-18 1976-02-18 Method and device for mounting solder wire Granted JPS52100174A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1728576A JPS52100174A (en) 1976-02-18 1976-02-18 Method and device for mounting solder wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1728576A JPS52100174A (en) 1976-02-18 1976-02-18 Method and device for mounting solder wire

Publications (2)

Publication Number Publication Date
JPS52100174A true JPS52100174A (en) 1977-08-22
JPS5724680B2 JPS5724680B2 (en) 1982-05-25

Family

ID=11939700

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1728576A Granted JPS52100174A (en) 1976-02-18 1976-02-18 Method and device for mounting solder wire

Country Status (1)

Country Link
JP (1) JPS52100174A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021104519A (en) * 2019-12-26 2021-07-26 株式会社超音波応用研究所 Joining method and joining device

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59151380U (en) * 1983-03-28 1984-10-09 小瀬　正雄 Security device for storing banknotes, etc.
JPS62175392U (en) * 1986-04-22 1987-11-07

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49101045U (en) * 1972-12-25 1974-08-30

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49101045U (en) * 1972-12-25 1974-08-30

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021104519A (en) * 2019-12-26 2021-07-26 株式会社超音波応用研究所 Joining method and joining device

Also Published As

Publication number Publication date
JPS5724680B2 (en) 1982-05-25

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