JPS5199475A - Furitsupuchitsupunofuesudaunbondeinguhoho - Google Patents
FuritsupuchitsupunofuesudaunbondeinguhohoInfo
- Publication number
- JPS5199475A JPS5199475A JP50024565A JP2456575A JPS5199475A JP S5199475 A JPS5199475 A JP S5199475A JP 50024565 A JP50024565 A JP 50024565A JP 2456575 A JP2456575 A JP 2456575A JP S5199475 A JPS5199475 A JP S5199475A
- Authority
- JP
- Japan
- Prior art keywords
- furitsupuchitsupunofuesudaunbondeinguhoho
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/741—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including a cavity for storing a finished or partly finished device during manufacturing or mounting, e.g. for an IC package or for a chip
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
- H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50024565A JPS5199475A (en) | 1975-02-28 | 1975-02-28 | Furitsupuchitsupunofuesudaunbondeinguhoho |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50024565A JPS5199475A (en) | 1975-02-28 | 1975-02-28 | Furitsupuchitsupunofuesudaunbondeinguhoho |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5199475A true JPS5199475A (en) | 1976-09-02 |
| JPS574096B2 JPS574096B2 (show.php) | 1982-01-25 |
Family
ID=12141667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50024565A Granted JPS5199475A (en) | 1975-02-28 | 1975-02-28 | Furitsupuchitsupunofuesudaunbondeinguhoho |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5199475A (show.php) |
-
1975
- 1975-02-28 JP JP50024565A patent/JPS5199475A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS574096B2 (show.php) | 1982-01-25 |