JPS5199475A - Furitsupuchitsupunofuesudaunbondeinguhoho - Google Patents

Furitsupuchitsupunofuesudaunbondeinguhoho

Info

Publication number
JPS5199475A
JPS5199475A JP2456575A JP2456575A JPS5199475A JP S5199475 A JPS5199475 A JP S5199475A JP 2456575 A JP2456575 A JP 2456575A JP 2456575 A JP2456575 A JP 2456575A JP S5199475 A JPS5199475 A JP S5199475A
Authority
JP
Japan
Prior art keywords
furitsupuchitsupunofuesudaunbondeinguhoho
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2456575A
Other languages
English (en)
Japanese (ja)
Other versions
JPS574096B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Teruo Etsuno
Tatsuo Noguchi
Masakado Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP2456575A priority Critical patent/JPS5199475A/ja
Publication of JPS5199475A publication Critical patent/JPS5199475A/ja
Publication of JPS574096B2 publication Critical patent/JPS574096B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Landscapes

  • Wire Bonding (AREA)
JP2456575A 1975-02-28 1975-02-28 Furitsupuchitsupunofuesudaunbondeinguhoho Granted JPS5199475A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2456575A JPS5199475A (ja) 1975-02-28 1975-02-28 Furitsupuchitsupunofuesudaunbondeinguhoho

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2456575A JPS5199475A (ja) 1975-02-28 1975-02-28 Furitsupuchitsupunofuesudaunbondeinguhoho

Publications (2)

Publication Number Publication Date
JPS5199475A true JPS5199475A (ja) 1976-09-02
JPS574096B2 JPS574096B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1982-01-25

Family

ID=12141667

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2456575A Granted JPS5199475A (ja) 1975-02-28 1975-02-28 Furitsupuchitsupunofuesudaunbondeinguhoho

Country Status (1)

Country Link
JP (1) JPS5199475A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Also Published As

Publication number Publication date
JPS574096B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1982-01-25

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