JPS5199474A - Furitsupuchitsupunofuesudaunbondeinguhoho - Google Patents

Furitsupuchitsupunofuesudaunbondeinguhoho

Info

Publication number
JPS5199474A
JPS5199474A JP50024564A JP2456475A JPS5199474A JP S5199474 A JPS5199474 A JP S5199474A JP 50024564 A JP50024564 A JP 50024564A JP 2456475 A JP2456475 A JP 2456475A JP S5199474 A JPS5199474 A JP S5199474A
Authority
JP
Japan
Prior art keywords
furitsupuchitsupunofuesudaunbondeinguhoho
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50024564A
Other languages
English (en)
Japanese (ja)
Other versions
JPS574095B2 (https=
Inventor
Teruo Etsuno
Tatsuo Noguchi
Masakado Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP50024564A priority Critical patent/JPS5199474A/ja
Publication of JPS5199474A publication Critical patent/JPS5199474A/ja
Publication of JPS574095B2 publication Critical patent/JPS574095B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/072Connecting or disconnecting of bump connectors
    • H10W72/07251Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/20Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Wire Bonding (AREA)
JP50024564A 1975-02-28 1975-02-28 Furitsupuchitsupunofuesudaunbondeinguhoho Granted JPS5199474A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50024564A JPS5199474A (en) 1975-02-28 1975-02-28 Furitsupuchitsupunofuesudaunbondeinguhoho

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50024564A JPS5199474A (en) 1975-02-28 1975-02-28 Furitsupuchitsupunofuesudaunbondeinguhoho

Publications (2)

Publication Number Publication Date
JPS5199474A true JPS5199474A (en) 1976-09-02
JPS574095B2 JPS574095B2 (https=) 1982-01-25

Family

ID=12141640

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50024564A Granted JPS5199474A (en) 1975-02-28 1975-02-28 Furitsupuchitsupunofuesudaunbondeinguhoho

Country Status (1)

Country Link
JP (1) JPS5199474A (https=)

Also Published As

Publication number Publication date
JPS574095B2 (https=) 1982-01-25

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