JPS5198966A - - Google Patents
Info
- Publication number
- JPS5198966A JPS5198966A JP50022925A JP2292575A JPS5198966A JP S5198966 A JPS5198966 A JP S5198966A JP 50022925 A JP50022925 A JP 50022925A JP 2292575 A JP2292575 A JP 2292575A JP S5198966 A JPS5198966 A JP S5198966A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50022925A JPS5198966A (enExample) | 1975-02-26 | 1975-02-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50022925A JPS5198966A (enExample) | 1975-02-26 | 1975-02-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5198966A true JPS5198966A (enExample) | 1976-08-31 |
Family
ID=12096204
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50022925A Pending JPS5198966A (enExample) | 1975-02-26 | 1975-02-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5198966A (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58129648U (ja) * | 1982-02-25 | 1983-09-02 | 日本電気ホームエレクトロニクス株式会社 | 電子部品のリ−ド曲げ切断装置 |
| JPS61179756U (enExample) * | 1985-04-30 | 1986-11-10 | ||
| JPH03198352A (ja) * | 1989-12-26 | 1991-08-29 | Yamada Seisakusho:Kk | リードフレームのモールド・フォーミング方法及びモールド・フォーミング装置 |
-
1975
- 1975-02-26 JP JP50022925A patent/JPS5198966A/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58129648U (ja) * | 1982-02-25 | 1983-09-02 | 日本電気ホームエレクトロニクス株式会社 | 電子部品のリ−ド曲げ切断装置 |
| JPS61179756U (enExample) * | 1985-04-30 | 1986-11-10 | ||
| JPH03198352A (ja) * | 1989-12-26 | 1991-08-29 | Yamada Seisakusho:Kk | リードフレームのモールド・フォーミング方法及びモールド・フォーミング装置 |