JPS5195779A - - Google Patents

Info

Publication number
JPS5195779A
JPS5195779A JP51001971A JP197176A JPS5195779A JP S5195779 A JPS5195779 A JP S5195779A JP 51001971 A JP51001971 A JP 51001971A JP 197176 A JP197176 A JP 197176A JP S5195779 A JPS5195779 A JP S5195779A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP51001971A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5195779A publication Critical patent/JPS5195779A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
JP51001971A 1975-01-09 1976-01-08 Pending JPS5195779A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/539,850 US3984861A (en) 1975-01-09 1975-01-09 Transcallent semiconductor device

Publications (1)

Publication Number Publication Date
JPS5195779A true JPS5195779A (en) 1976-08-21

Family

ID=24152914

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51001971A Pending JPS5195779A (en) 1975-01-09 1976-01-08

Country Status (3)

Country Link
US (1) US3984861A (en)
JP (1) JPS5195779A (en)
DE (1) DE2555662A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5911657A (en) * 1982-07-12 1984-01-21 Kansai Electric Power Co Inc:The Cooling device for thyristor

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4386362A (en) * 1979-12-26 1983-05-31 Rca Corporation Center gate semiconductor device having pipe cooling means
US4559580A (en) * 1983-11-04 1985-12-17 Sundstrand Corporation Semiconductor package with internal heat exchanger
US5008735A (en) * 1989-12-07 1991-04-16 General Instrument Corporation Packaged diode for high temperature operation
US5386143A (en) * 1991-10-25 1995-01-31 Digital Equipment Corporation High performance substrate, electronic package and integrated circuit cooling process
US5441102A (en) * 1994-01-26 1995-08-15 Sun Microsystems, Inc. Heat exchanger for electronic equipment
US6525420B2 (en) * 2001-01-30 2003-02-25 Thermal Corp. Semiconductor package with lid heat spreader
EP1308686A1 (en) * 2001-11-06 2003-05-07 Agilent Technologies, Inc. (a Delaware corporation) Thermal management
US7002247B2 (en) * 2004-06-18 2006-02-21 International Business Machines Corporation Thermal interposer for thermal management of semiconductor devices
US7180179B2 (en) * 2004-06-18 2007-02-20 International Business Machines Corporation Thermal interposer for thermal management of semiconductor devices
JP4305406B2 (en) * 2005-03-18 2009-07-29 三菱電機株式会社 Cooling structure
US9086229B1 (en) 2006-10-13 2015-07-21 Hrl Laboratories, Llc Optical components from micro-architected trusses
US9229162B1 (en) 2006-10-13 2016-01-05 Hrl Laboratories, Llc Three-dimensional ordered diamond cellular structures and method of making the same
US8579018B1 (en) 2009-03-23 2013-11-12 Hrl Laboratories, Llc Lightweight sandwich panel heat pipe
US8573289B1 (en) 2009-07-20 2013-11-05 Hrl Laboratories, Llc Micro-architected materials for heat exchanger applications
US8453717B1 (en) 2009-07-20 2013-06-04 Hrl Laboratories, Llc Micro-architected materials for heat sink applications
US9546826B1 (en) 2010-01-21 2017-01-17 Hrl Laboratories, Llc Microtruss based thermal heat spreading structures
US8921702B1 (en) * 2010-01-21 2014-12-30 Hrl Laboratories, Llc Microtruss based thermal plane structures and microelectronics and printed wiring board embodiments
US8771330B1 (en) 2010-05-19 2014-07-08 Hrl Laboratories, Llc Personal artificial transpiration cooling system
US8857182B1 (en) 2010-05-19 2014-10-14 Hrl Laboratories, Llc Power generation through artificial transpiration
US9758382B1 (en) 2011-01-31 2017-09-12 Hrl Laboratories, Llc Three-dimensional ordered diamond cellular structures and method of making the same
US9405067B2 (en) 2013-03-13 2016-08-02 Hrl Laboratories, Llc Micro-truss materials having in-plane material property variations

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4887779A (en) * 1972-02-01 1973-11-17
US3852805A (en) * 1973-06-18 1974-12-03 Gen Electric Heat-pipe cooled power semiconductor device assembly having integral semiconductor device evaporating surface unit
US3852803A (en) * 1973-06-18 1974-12-03 Gen Electric Heat sink cooled power semiconductor device assembly having liquid metal interface

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3739235A (en) * 1972-01-31 1973-06-12 Rca Corp Transcalent semiconductor device
US3852804A (en) * 1973-05-02 1974-12-03 Gen Electric Double-sided heat-pipe cooled power semiconductor device assembly
US3826957A (en) * 1973-07-02 1974-07-30 Gen Electric Double-sided heat-pipe cooled power semiconductor device assembly using compression rods

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4887779A (en) * 1972-02-01 1973-11-17
US3852805A (en) * 1973-06-18 1974-12-03 Gen Electric Heat-pipe cooled power semiconductor device assembly having integral semiconductor device evaporating surface unit
US3852803A (en) * 1973-06-18 1974-12-03 Gen Electric Heat sink cooled power semiconductor device assembly having liquid metal interface

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5911657A (en) * 1982-07-12 1984-01-21 Kansai Electric Power Co Inc:The Cooling device for thyristor

Also Published As

Publication number Publication date
DE2555662A1 (en) 1976-07-15
US3984861A (en) 1976-10-05

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