JPS5190837A - - Google Patents
Info
- Publication number
- JPS5190837A JPS5190837A JP50016548A JP1654875A JPS5190837A JP S5190837 A JPS5190837 A JP S5190837A JP 50016548 A JP50016548 A JP 50016548A JP 1654875 A JP1654875 A JP 1654875A JP S5190837 A JPS5190837 A JP S5190837A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Glass Melting And Manufacturing (AREA)
- Manufacture, Treatment Of Glass Fibers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1654875A JPS5645868B2 (https=) | 1975-02-08 | 1975-02-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1654875A JPS5645868B2 (https=) | 1975-02-08 | 1975-02-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5190837A true JPS5190837A (https=) | 1976-08-09 |
| JPS5645868B2 JPS5645868B2 (https=) | 1981-10-29 |
Family
ID=11919311
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1654875A Expired JPS5645868B2 (https=) | 1975-02-08 | 1975-02-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5645868B2 (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5436433U (https=) * | 1977-08-17 | 1979-03-09 | ||
| US7540079B2 (en) | 2003-01-23 | 2009-06-02 | Toray Industries, Inc. | Laminated member for circuit board, method and apparatus for manufacturing of circuit board |
-
1975
- 1975-02-08 JP JP1654875A patent/JPS5645868B2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5436433U (https=) * | 1977-08-17 | 1979-03-09 | ||
| US7540079B2 (en) | 2003-01-23 | 2009-06-02 | Toray Industries, Inc. | Laminated member for circuit board, method and apparatus for manufacturing of circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5645868B2 (https=) | 1981-10-29 |