JPS5188177U - - Google Patents
Info
- Publication number
- JPS5188177U JPS5188177U JP1975005820U JP582075U JPS5188177U JP S5188177 U JPS5188177 U JP S5188177U JP 1975005820 U JP1975005820 U JP 1975005820U JP 582075 U JP582075 U JP 582075U JP S5188177 U JPS5188177 U JP S5188177U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07521—Aligning
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975005820U JPS5188177U (enExample) | 1975-01-11 | 1975-01-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975005820U JPS5188177U (enExample) | 1975-01-11 | 1975-01-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5188177U true JPS5188177U (enExample) | 1976-07-14 |
Family
ID=28069222
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1975005820U Pending JPS5188177U (enExample) | 1975-01-11 | 1975-01-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5188177U (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6143715A (ja) * | 1985-07-19 | 1986-03-03 | Hitachi Ltd | ワイヤボンダ |
| US11898065B2 (en) | 2018-11-30 | 2024-02-13 | Dow-Mitsui Polychemicals Co., Ltd. | Resin composition for sealant, laminate, packaging material, and package |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4918619U (enExample) * | 1972-05-23 | 1974-02-16 |
-
1975
- 1975-01-11 JP JP1975005820U patent/JPS5188177U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4918619U (enExample) * | 1972-05-23 | 1974-02-16 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6143715A (ja) * | 1985-07-19 | 1986-03-03 | Hitachi Ltd | ワイヤボンダ |
| US11898065B2 (en) | 2018-11-30 | 2024-02-13 | Dow-Mitsui Polychemicals Co., Ltd. | Resin composition for sealant, laminate, packaging material, and package |