JPS5186985A - - Google Patents
Info
- Publication number
- JPS5186985A JPS5186985A JP50011213A JP1121375A JPS5186985A JP S5186985 A JPS5186985 A JP S5186985A JP 50011213 A JP50011213 A JP 50011213A JP 1121375 A JP1121375 A JP 1121375A JP S5186985 A JPS5186985 A JP S5186985A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Weting (AREA)
- Electrodes Of Semiconductors (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50011213A JPS5810855B2 (ja) | 1975-01-29 | 1975-01-29 | タソウハイセンコウゾウノセイホウ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50011213A JPS5810855B2 (ja) | 1975-01-29 | 1975-01-29 | タソウハイセンコウゾウノセイホウ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5186985A true JPS5186985A (zh) | 1976-07-30 |
JPS5810855B2 JPS5810855B2 (ja) | 1983-02-28 |
Family
ID=11771697
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50011213A Expired JPS5810855B2 (ja) | 1975-01-29 | 1975-01-29 | タソウハイセンコウゾウノセイホウ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5810855B2 (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6276653A (ja) * | 1985-09-30 | 1987-04-08 | Toshiba Corp | 半導体集積回路 |
JPH01255250A (ja) * | 1988-04-05 | 1989-10-12 | Fujitsu Ltd | 多層配線形成方法 |
JPH03291993A (ja) * | 1990-04-10 | 1991-12-24 | Fujitsu Ltd | ポリイミド多層基板及びその製造方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50107876A (zh) * | 1974-01-30 | 1975-08-25 |
-
1975
- 1975-01-29 JP JP50011213A patent/JPS5810855B2/ja not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50107876A (zh) * | 1974-01-30 | 1975-08-25 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6276653A (ja) * | 1985-09-30 | 1987-04-08 | Toshiba Corp | 半導体集積回路 |
JPH01255250A (ja) * | 1988-04-05 | 1989-10-12 | Fujitsu Ltd | 多層配線形成方法 |
JPH03291993A (ja) * | 1990-04-10 | 1991-12-24 | Fujitsu Ltd | ポリイミド多層基板及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS5810855B2 (ja) | 1983-02-28 |