JPS51868U - - Google Patents

Info

Publication number
JPS51868U
JPS51868U JP7210274U JP7210274U JPS51868U JP S51868 U JPS51868 U JP S51868U JP 7210274 U JP7210274 U JP 7210274U JP 7210274 U JP7210274 U JP 7210274U JP S51868 U JPS51868 U JP S51868U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7210274U
Other languages
Japanese (ja)
Other versions
JPS5623898Y2 (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1974072102U priority Critical patent/JPS5623898Y2/ja
Publication of JPS51868U publication Critical patent/JPS51868U/ja
Application granted granted Critical
Publication of JPS5623898Y2 publication Critical patent/JPS5623898Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Inductance-Capacitance Distribution Constants And Capacitance-Resistance Oscillators (AREA)
  • Stabilization Of Oscillater, Synchronisation, Frequency Synthesizers (AREA)
JP1974072102U 1974-06-20 1974-06-20 Expired JPS5623898Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1974072102U JPS5623898Y2 (enExample) 1974-06-20 1974-06-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1974072102U JPS5623898Y2 (enExample) 1974-06-20 1974-06-20

Publications (2)

Publication Number Publication Date
JPS51868U true JPS51868U (enExample) 1976-01-06
JPS5623898Y2 JPS5623898Y2 (enExample) 1981-06-04

Family

ID=28242362

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1974072102U Expired JPS5623898Y2 (enExample) 1974-06-20 1974-06-20

Country Status (1)

Country Link
JP (1) JPS5623898Y2 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5354500A (en) * 1976-10-27 1978-05-17 Gutsudowan Kk Traffic alarm system
JPS54141983A (en) * 1978-04-25 1979-11-05 Onishi Hitoshi System for transmitting traffic information into vehicles
JPS58187899U (ja) * 1982-06-09 1983-12-13 杉山　信二 路面用補助信号機
WO1991004575A1 (fr) * 1989-09-12 1991-04-04 Kabushiki Kaisha Toshiba Cadre de montage pour dispositif a semi-conducteurs et dispositif a semi-conducteurs utilisant ce cadre de montage

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5238915U (enExample) * 1975-09-11 1977-03-18

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5238915U (enExample) * 1975-09-11 1977-03-18

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5354500A (en) * 1976-10-27 1978-05-17 Gutsudowan Kk Traffic alarm system
JPS54141983A (en) * 1978-04-25 1979-11-05 Onishi Hitoshi System for transmitting traffic information into vehicles
JPS58187899U (ja) * 1982-06-09 1983-12-13 杉山　信二 路面用補助信号機
WO1991004575A1 (fr) * 1989-09-12 1991-04-04 Kabushiki Kaisha Toshiba Cadre de montage pour dispositif a semi-conducteurs et dispositif a semi-conducteurs utilisant ce cadre de montage
US5200806A (en) * 1989-09-12 1993-04-06 Kabushiki Kaisha Toshiba Lead frame having a plurality of island regions and a suspension pin

Also Published As

Publication number Publication date
JPS5623898Y2 (enExample) 1981-06-04

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