JPS5179568A - - Google Patents

Info

Publication number
JPS5179568A
JPS5179568A JP50000090A JP9075A JPS5179568A JP S5179568 A JPS5179568 A JP S5179568A JP 50000090 A JP50000090 A JP 50000090A JP 9075 A JP9075 A JP 9075A JP S5179568 A JPS5179568 A JP S5179568A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50000090A
Other languages
Japanese (ja)
Inventor
Shunichiro Fujioka
Michio Tanimoto
Shunei Uematsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50000090A priority Critical patent/JPS5179568A/ja
Publication of JPS5179568A publication Critical patent/JPS5179568A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
JP50000090A 1975-01-06 1975-01-06 Pending JPS5179568A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50000090A JPS5179568A (en) 1975-01-06 1975-01-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50000090A JPS5179568A (en) 1975-01-06 1975-01-06

Publications (1)

Publication Number Publication Date
JPS5179568A true JPS5179568A (en) 1976-07-10

Family

ID=11464410

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50000090A Pending JPS5179568A (en) 1975-01-06 1975-01-06

Country Status (1)

Country Link
JP (1) JPS5179568A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57170233A (en) * 1981-04-15 1982-10-20 Japan Radio Ueda Co Ltd Ultrasonic probe for ultrasonic diagnosis
JPS58138353U (en) * 1982-03-12 1983-09-17 京セラ株式会社 semiconductor package

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57170233A (en) * 1981-04-15 1982-10-20 Japan Radio Ueda Co Ltd Ultrasonic probe for ultrasonic diagnosis
JPS58138353U (en) * 1982-03-12 1983-09-17 京セラ株式会社 semiconductor package
JPS633166Y2 (en) * 1982-03-12 1988-01-26

Similar Documents

Publication Publication Date Title
JPS5746984B2 (en)
IN143896B (en)
JPS5338748B2 (en)
JPS51101166A (en)
JPS5179568A (en)
JPS553111B2 (en)
JPS528966U (en)
JPS5532880Y2 (en)
JPS51145521U (en)
JPS5258114U (en)
JPS5275786U (en)
CH597385A5 (en)
CH592771B5 (en)
CH601707A5 (en)
CH602971A5 (en)
CH601054A5 (en)
CH600805A5 (en)
CH599656A5 (en)
CH598898A5 (en)
CH598520A5 (en)
CH598487A5 (en)
CH598131A5 (en)
CH597707A5 (en)
CH597391A5 (en)
CH592404A5 (en)