JPS5174758U - - Google Patents

Info

Publication number
JPS5174758U
JPS5174758U JP14852074U JP14852074U JPS5174758U JP S5174758 U JPS5174758 U JP S5174758U JP 14852074 U JP14852074 U JP 14852074U JP 14852074 U JP14852074 U JP 14852074U JP S5174758 U JPS5174758 U JP S5174758U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14852074U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14852074U priority Critical patent/JPS5174758U/ja
Publication of JPS5174758U publication Critical patent/JPS5174758U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191Disposition
    • H01L2924/19101Disposition of discrete passive components
    • H01L2924/19105Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP14852074U 1974-12-06 1974-12-06 Pending JPS5174758U (enrdf_load_html_response)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14852074U JPS5174758U (enrdf_load_html_response) 1974-12-06 1974-12-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14852074U JPS5174758U (enrdf_load_html_response) 1974-12-06 1974-12-06

Publications (1)

Publication Number Publication Date
JPS5174758U true JPS5174758U (enrdf_load_html_response) 1976-06-11

Family

ID=28440276

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14852074U Pending JPS5174758U (enrdf_load_html_response) 1974-12-06 1974-12-06

Country Status (1)

Country Link
JP (1) JPS5174758U (enrdf_load_html_response)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54161270A (en) * 1978-06-09 1979-12-20 Nec Corp Lead frame for integrated-circuit device
JPS56132757U (enrdf_load_html_response) * 1980-03-05 1981-10-08

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4818954B1 (enrdf_load_html_response) * 1969-09-13 1973-06-09

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4818954B1 (enrdf_load_html_response) * 1969-09-13 1973-06-09

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54161270A (en) * 1978-06-09 1979-12-20 Nec Corp Lead frame for integrated-circuit device
JPS56132757U (enrdf_load_html_response) * 1980-03-05 1981-10-08

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