JPS5174758U - - Google Patents
Info
- Publication number
- JPS5174758U JPS5174758U JP14852074U JP14852074U JPS5174758U JP S5174758 U JPS5174758 U JP S5174758U JP 14852074 U JP14852074 U JP 14852074U JP 14852074 U JP14852074 U JP 14852074U JP S5174758 U JPS5174758 U JP S5174758U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14852074U JPS5174758U (enrdf_load_html_response) | 1974-12-06 | 1974-12-06 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14852074U JPS5174758U (enrdf_load_html_response) | 1974-12-06 | 1974-12-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5174758U true JPS5174758U (enrdf_load_html_response) | 1976-06-11 |
Family
ID=28440276
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14852074U Pending JPS5174758U (enrdf_load_html_response) | 1974-12-06 | 1974-12-06 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5174758U (enrdf_load_html_response) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54161270A (en) * | 1978-06-09 | 1979-12-20 | Nec Corp | Lead frame for integrated-circuit device |
JPS56132757U (enrdf_load_html_response) * | 1980-03-05 | 1981-10-08 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4818954B1 (enrdf_load_html_response) * | 1969-09-13 | 1973-06-09 |
-
1974
- 1974-12-06 JP JP14852074U patent/JPS5174758U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4818954B1 (enrdf_load_html_response) * | 1969-09-13 | 1973-06-09 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54161270A (en) * | 1978-06-09 | 1979-12-20 | Nec Corp | Lead frame for integrated-circuit device |
JPS56132757U (enrdf_load_html_response) * | 1980-03-05 | 1981-10-08 |