JPS5164866A - HANDOTAISOCHINOSEIZOHOHO - Google Patents
HANDOTAISOCHINOSEIZOHOHOInfo
- Publication number
- JPS5164866A JPS5164866A JP13908674A JP13908674A JPS5164866A JP S5164866 A JPS5164866 A JP S5164866A JP 13908674 A JP13908674 A JP 13908674A JP 13908674 A JP13908674 A JP 13908674A JP S5164866 A JPS5164866 A JP S5164866A
- Authority
- JP
- Japan
- Prior art keywords
- handotaisochinoseizohoho
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Dicing (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13908674A JPS5164866A (en) | 1974-12-03 | 1974-12-03 | HANDOTAISOCHINOSEIZOHOHO |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13908674A JPS5164866A (en) | 1974-12-03 | 1974-12-03 | HANDOTAISOCHINOSEIZOHOHO |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5164866A true JPS5164866A (en) | 1976-06-04 |
Family
ID=15237150
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13908674A Pending JPS5164866A (en) | 1974-12-03 | 1974-12-03 | HANDOTAISOCHINOSEIZOHOHO |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5164866A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005104250A1 (en) * | 2004-04-20 | 2005-11-03 | Showa Denko K.K. | Production method of compound semiconductor light-emitting device wafer |
JP2009152289A (en) * | 2007-12-19 | 2009-07-09 | Tokyo Seimitsu Co Ltd | Laser dicing apparatus and dicing method |
JP2009525183A (en) * | 2006-02-02 | 2009-07-09 | エグシル テクノロジー リミテッド | Laser processing apparatus and method comprising a vacuum evacuation system and at least a first containment zone to contain a deposit of released hazardous material |
-
1974
- 1974-12-03 JP JP13908674A patent/JPS5164866A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005104250A1 (en) * | 2004-04-20 | 2005-11-03 | Showa Denko K.K. | Production method of compound semiconductor light-emitting device wafer |
EP1738419A1 (en) * | 2004-04-20 | 2007-01-03 | Showa Denko K.K. | Production method of compound semiconductor light-emitting device wafer |
US7700413B2 (en) | 2004-04-20 | 2010-04-20 | Showa Denko K.K. | Production method of compound semiconductor light-emitting device wafer |
EP1738419A4 (en) * | 2004-04-20 | 2011-07-06 | Showa Denko Kk | Production method of compound semiconductor light-emitting device wafer |
JP2009525183A (en) * | 2006-02-02 | 2009-07-09 | エグシル テクノロジー リミテッド | Laser processing apparatus and method comprising a vacuum evacuation system and at least a first containment zone to contain a deposit of released hazardous material |
JP2009152289A (en) * | 2007-12-19 | 2009-07-09 | Tokyo Seimitsu Co Ltd | Laser dicing apparatus and dicing method |
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