JPS5160180A - Handotaisochino seizohoho - Google Patents
Handotaisochino seizohohoInfo
- Publication number
- JPS5160180A JPS5160180A JP49133646A JP13364674A JPS5160180A JP S5160180 A JPS5160180 A JP S5160180A JP 49133646 A JP49133646 A JP 49133646A JP 13364674 A JP13364674 A JP 13364674A JP S5160180 A JPS5160180 A JP S5160180A
- Authority
- JP
- Japan
- Prior art keywords
- handotaisochino seizohoho
- handotaisochino
- seizohoho
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/03—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/023—Redistribution layers [RDL] for bonding areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05541—Structure
- H01L2224/05548—Bonding area integrally formed with a redistribution layer on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05556—Shape in side view
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP49133646A JPS5160180A (en) | 1974-11-22 | 1974-11-22 | Handotaisochino seizohoho |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP49133646A JPS5160180A (en) | 1974-11-22 | 1974-11-22 | Handotaisochino seizohoho |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5160180A true JPS5160180A (en) | 1976-05-25 |
Family
ID=15109662
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP49133646A Pending JPS5160180A (en) | 1974-11-22 | 1974-11-22 | Handotaisochino seizohoho |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5160180A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01310544A (en) * | 1988-06-08 | 1989-12-14 | Mitsubishi Electric Corp | Semiconductor device |
-
1974
- 1974-11-22 JP JP49133646A patent/JPS5160180A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01310544A (en) * | 1988-06-08 | 1989-12-14 | Mitsubishi Electric Corp | Semiconductor device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CS598377A2 (en) | Zpusob vyroby novych heterocyklickych sloucenin | |
GB1539190A (en) | Aminonitropyridines | |
CS62475A2 (en) | Elektricky stroj chlazeny plynem | |
GB1489305A (en) | Fluid-oscillator | |
GB1484787A (en) | N-heterocyclic-substituted-3-quinoline-carboxamides | |
CS621475A2 (en) | Zpusob soucasneho stanoveni nekolika nebo vsech isoenzymu laktatdihydrogenazy | |
AU8751375A (en) | 3-chloro-2-oxazolidinones | |
GB1482343A (en) | Carbonyl-aldiminomethanephosphonates | |
AU8166575A (en) | 11-deoxy-13-dihydro-prostaglandin-9-ketals | |
AU8349775A (en) | Beer-wort | |
CS324775A2 (en) | Zpusob vyroby ferromagnetickeho kyslicniku chromiciteho | |
JPS5111466A (en) | Ringutaino sokuteisochi | |
AU8270675A (en) | 17-beta-hydroxy-androst-4-en-3-ones | |
AU7973175A (en) | Pyroscrubber | |
JPS5117175A (en) | Ekichuno jushubutsushitsuno jokyohoho | |
AU8421275A (en) | D-homo-steroids | |
JPS5113125A (en) | Domano hoshuhoho | |
GB1484002A (en) | 11-aminoalkylmorphanthridin-11-ols | |
GB1485897A (en) | Benzene-disulphonamides | |
JPS5113369A (en) | Funikironaiheno fukatsuseigasukyokyusochi | |
AU7852875A (en) | 5-cyano-thiophen-2-aldehyde-isothiosemicarbazones | |
AU8270075A (en) | Speedometer-odometer | |
AU7697474A (en) | Ellipsograph | |
AU8725975A (en) | Octahydromorphanthridines | |
AU8091375A (en) | Jmmunosthimulating clycopeptide |