JPS5156170A - - Google Patents
Info
- Publication number
- JPS5156170A JPS5156170A JP12996274A JP12996274A JPS5156170A JP S5156170 A JPS5156170 A JP S5156170A JP 12996274 A JP12996274 A JP 12996274A JP 12996274 A JP12996274 A JP 12996274A JP S5156170 A JPS5156170 A JP S5156170A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
- H01L2924/10157—Shape being other than a cuboid at the active surface
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12996274A JPS5156170A (en) | 1974-11-13 | 1974-11-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12996274A JPS5156170A (en) | 1974-11-13 | 1974-11-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5156170A true JPS5156170A (en) | 1976-05-17 |
Family
ID=15022725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12996274A Pending JPS5156170A (en) | 1974-11-13 | 1974-11-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5156170A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6042442A (en) * | 1996-02-28 | 2000-03-28 | Nec Corporation | Enhancement in bonding strength in field emission electron source |
-
1974
- 1974-11-13 JP JP12996274A patent/JPS5156170A/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6042442A (en) * | 1996-02-28 | 2000-03-28 | Nec Corporation | Enhancement in bonding strength in field emission electron source |