JPS5150661Y2 - - Google Patents
Info
- Publication number
- JPS5150661Y2 JPS5150661Y2 JP13461872U JP13461872U JPS5150661Y2 JP S5150661 Y2 JPS5150661 Y2 JP S5150661Y2 JP 13461872 U JP13461872 U JP 13461872U JP 13461872 U JP13461872 U JP 13461872U JP S5150661 Y2 JPS5150661 Y2 JP S5150661Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Air-Flow Control Members (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13461872U JPS5150661Y2 (https=) | 1972-11-22 | 1972-11-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13461872U JPS5150661Y2 (https=) | 1972-11-22 | 1972-11-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4991146U JPS4991146U (https=) | 1974-08-07 |
| JPS5150661Y2 true JPS5150661Y2 (https=) | 1976-12-06 |
Family
ID=28401758
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13461872U Expired JPS5150661Y2 (https=) | 1972-11-22 | 1972-11-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5150661Y2 (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9570416B2 (en) | 2004-11-03 | 2017-02-14 | Tessera, Inc. | Stacked packaging improvements |
| US10170412B2 (en) | 2012-05-22 | 2019-01-01 | Invensas Corporation | Substrate-less stackable package with wire-bond interconnect |
-
1972
- 1972-11-22 JP JP13461872U patent/JPS5150661Y2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9570416B2 (en) | 2004-11-03 | 2017-02-14 | Tessera, Inc. | Stacked packaging improvements |
| US10170412B2 (en) | 2012-05-22 | 2019-01-01 | Invensas Corporation | Substrate-less stackable package with wire-bond interconnect |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4991146U (https=) | 1974-08-07 |