JPS5149960U - - Google Patents
Info
- Publication number
- JPS5149960U JPS5149960U JP1974123740U JP12374074U JPS5149960U JP S5149960 U JPS5149960 U JP S5149960U JP 1974123740 U JP1974123740 U JP 1974123740U JP 12374074 U JP12374074 U JP 12374074U JP S5149960 U JPS5149960 U JP S5149960U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1974123740U JPS5149960U (enFirst) | 1974-10-14 | 1974-10-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1974123740U JPS5149960U (enFirst) | 1974-10-14 | 1974-10-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5149960U true JPS5149960U (enFirst) | 1976-04-15 |
Family
ID=28371072
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1974123740U Pending JPS5149960U (enFirst) | 1974-10-14 | 1974-10-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5149960U (enFirst) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55160449A (en) * | 1979-05-31 | 1980-12-13 | Toshiba Corp | Semiconductor device |
| JPS57175448U (enFirst) * | 1981-04-30 | 1982-11-05 |
-
1974
- 1974-10-14 JP JP1974123740U patent/JPS5149960U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55160449A (en) * | 1979-05-31 | 1980-12-13 | Toshiba Corp | Semiconductor device |
| JPS57175448U (enFirst) * | 1981-04-30 | 1982-11-05 |