JPS5149684A - - Google Patents

Info

Publication number
JPS5149684A
JPS5149684A JP49123776A JP12377674A JPS5149684A JP S5149684 A JPS5149684 A JP S5149684A JP 49123776 A JP49123776 A JP 49123776A JP 12377674 A JP12377674 A JP 12377674A JP S5149684 A JPS5149684 A JP S5149684A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP49123776A
Other languages
Japanese (ja)
Other versions
JPS5750071B2 (no
Inventor
Shinichi Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP49123776A priority Critical patent/JPS5750071B2/ja
Publication of JPS5149684A publication Critical patent/JPS5149684A/ja
Publication of JPS5750071B2 publication Critical patent/JPS5750071B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP49123776A 1974-10-25 1974-10-25 Expired JPS5750071B2 (no)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP49123776A JPS5750071B2 (no) 1974-10-25 1974-10-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49123776A JPS5750071B2 (no) 1974-10-25 1974-10-25

Publications (2)

Publication Number Publication Date
JPS5149684A true JPS5149684A (no) 1976-04-30
JPS5750071B2 JPS5750071B2 (no) 1982-10-25

Family

ID=14868987

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49123776A Expired JPS5750071B2 (no) 1974-10-25 1974-10-25

Country Status (1)

Country Link
JP (1) JPS5750071B2 (no)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0346262A (ja) * 1989-07-13 1991-02-27 Nitto Denko Corp 半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4826973A (no) * 1971-08-10 1973-04-09

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4826973A (no) * 1971-08-10 1973-04-09

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0346262A (ja) * 1989-07-13 1991-02-27 Nitto Denko Corp 半導体装置

Also Published As

Publication number Publication date
JPS5750071B2 (no) 1982-10-25

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