JPS514633B1 - - Google Patents
Info
- Publication number
- JPS514633B1 JPS514633B1 JP45035714A JP3571470A JPS514633B1 JP S514633 B1 JPS514633 B1 JP S514633B1 JP 45035714 A JP45035714 A JP 45035714A JP 3571470 A JP3571470 A JP 3571470A JP S514633 B1 JPS514633 B1 JP S514633B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP45035714A JPS514633B1 (enrdf_load_stackoverflow) | 1970-04-25 | 1970-04-25 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP45035714A JPS514633B1 (enrdf_load_stackoverflow) | 1970-04-25 | 1970-04-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS514633B1 true JPS514633B1 (enrdf_load_stackoverflow) | 1976-02-13 |
Family
ID=12449518
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP45035714A Pending JPS514633B1 (enrdf_load_stackoverflow) | 1970-04-25 | 1970-04-25 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS514633B1 (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52137133U (enrdf_load_stackoverflow) * | 1976-04-13 | 1977-10-18 |
-
1970
- 1970-04-25 JP JP45035714A patent/JPS514633B1/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52137133U (enrdf_load_stackoverflow) * | 1976-04-13 | 1977-10-18 |