JPS5146069A - - Google Patents
Info
- Publication number
- JPS5146069A JPS5146069A JP49119334A JP11933474A JPS5146069A JP S5146069 A JPS5146069 A JP S5146069A JP 49119334 A JP49119334 A JP 49119334A JP 11933474 A JP11933474 A JP 11933474A JP S5146069 A JPS5146069 A JP S5146069A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05556—Shape in side view
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Semiconductor Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49119334A JPS5146069A (enExample) | 1974-10-18 | 1974-10-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49119334A JPS5146069A (enExample) | 1974-10-18 | 1974-10-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5146069A true JPS5146069A (enExample) | 1976-04-20 |
Family
ID=14758897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP49119334A Pending JPS5146069A (enExample) | 1974-10-18 | 1974-10-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5146069A (enExample) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54122674A (en) * | 1978-03-16 | 1979-09-22 | Nobuko Watanabe | Production stator for magnetic clutch |
| JPS54163917U (enExample) * | 1978-05-10 | 1979-11-16 | ||
| JPS5575845A (en) * | 1978-12-04 | 1980-06-07 | Masako Watanabe | Production of rotor for electromagnetic clutche |
| JPS55157240A (en) * | 1979-05-25 | 1980-12-06 | Nec Corp | Semiconductor device |
| JPS56113771U (enExample) * | 1980-02-01 | 1981-09-02 | ||
| JPS5739026A (en) * | 1980-08-15 | 1982-03-04 | Heiwa Shoji Kk | Manufacture of fin part for heat exchanger |
| JPS57166039A (en) * | 1981-04-06 | 1982-10-13 | Toshiba Corp | Semiconductor device and its manufacture |
| JPS57190333A (en) * | 1981-05-20 | 1982-11-22 | Toshiba Corp | Semiconductor device |
| WO1999065075A1 (en) * | 1998-06-12 | 1999-12-16 | Hitachi, Ltd. | Semiconductor device and method for manufacturing the same |
-
1974
- 1974-10-18 JP JP49119334A patent/JPS5146069A/ja active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54122674A (en) * | 1978-03-16 | 1979-09-22 | Nobuko Watanabe | Production stator for magnetic clutch |
| JPS54163917U (enExample) * | 1978-05-10 | 1979-11-16 | ||
| JPS5575845A (en) * | 1978-12-04 | 1980-06-07 | Masako Watanabe | Production of rotor for electromagnetic clutche |
| JPS55157240A (en) * | 1979-05-25 | 1980-12-06 | Nec Corp | Semiconductor device |
| JPS56113771U (enExample) * | 1980-02-01 | 1981-09-02 | ||
| JPS5739026A (en) * | 1980-08-15 | 1982-03-04 | Heiwa Shoji Kk | Manufacture of fin part for heat exchanger |
| JPS57166039A (en) * | 1981-04-06 | 1982-10-13 | Toshiba Corp | Semiconductor device and its manufacture |
| JPS57190333A (en) * | 1981-05-20 | 1982-11-22 | Toshiba Corp | Semiconductor device |
| WO1999065075A1 (en) * | 1998-06-12 | 1999-12-16 | Hitachi, Ltd. | Semiconductor device and method for manufacturing the same |