JPS5144871A - - Google Patents
Info
- Publication number
- JPS5144871A JPS5144871A JP49119025A JP11902574A JPS5144871A JP S5144871 A JPS5144871 A JP S5144871A JP 49119025 A JP49119025 A JP 49119025A JP 11902574 A JP11902574 A JP 11902574A JP S5144871 A JPS5144871 A JP S5144871A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W72/30—
-
- H10W90/754—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49119025A JPS5811736B2 (ja) | 1974-10-15 | 1974-10-15 | ハンドウタイソウチ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49119025A JPS5811736B2 (ja) | 1974-10-15 | 1974-10-15 | ハンドウタイソウチ |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57070139A Division JPS606090B2 (ja) | 1982-04-26 | 1982-04-26 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5144871A true JPS5144871A (enExample) | 1976-04-16 |
| JPS5811736B2 JPS5811736B2 (ja) | 1983-03-04 |
Family
ID=14751110
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP49119025A Expired JPS5811736B2 (ja) | 1974-10-15 | 1974-10-15 | ハンドウタイソウチ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5811736B2 (enExample) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5776848A (en) * | 1980-10-30 | 1982-05-14 | Seiko Epson Corp | Mounting method for integrated circuit chip |
| JPS57184225A (en) * | 1982-04-26 | 1982-11-12 | Nec Corp | Semiconductor device |
| JPS59141292A (ja) * | 1983-02-01 | 1984-08-13 | イビデン株式会社 | プリント配線用積層板の製造方法 |
| US4520041A (en) * | 1982-11-04 | 1985-05-28 | Tokyo Shibaura Denki Kabushiki Kaisha | Method for forming metallization structure having flat surface on semiconductor substrate |
| US4528216A (en) * | 1983-02-24 | 1985-07-09 | Oki Electric Industry Co., Ltd. | Process for forming heat-resistant resin films of polyimide and organosilicic reactants |
| US7651436B2 (en) | 2004-06-22 | 2010-01-26 | Nobuyoshi Sugitani | Gear mechanism, planetary gear device, rotating bearing device, and magical planetary gear speed reducer |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4918590U (enExample) * | 1972-05-19 | 1974-02-16 |
-
1974
- 1974-10-15 JP JP49119025A patent/JPS5811736B2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4918590U (enExample) * | 1972-05-19 | 1974-02-16 |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5776848A (en) * | 1980-10-30 | 1982-05-14 | Seiko Epson Corp | Mounting method for integrated circuit chip |
| JPS57184225A (en) * | 1982-04-26 | 1982-11-12 | Nec Corp | Semiconductor device |
| US4520041A (en) * | 1982-11-04 | 1985-05-28 | Tokyo Shibaura Denki Kabushiki Kaisha | Method for forming metallization structure having flat surface on semiconductor substrate |
| JPS59141292A (ja) * | 1983-02-01 | 1984-08-13 | イビデン株式会社 | プリント配線用積層板の製造方法 |
| US4528216A (en) * | 1983-02-24 | 1985-07-09 | Oki Electric Industry Co., Ltd. | Process for forming heat-resistant resin films of polyimide and organosilicic reactants |
| US7651436B2 (en) | 2004-06-22 | 2010-01-26 | Nobuyoshi Sugitani | Gear mechanism, planetary gear device, rotating bearing device, and magical planetary gear speed reducer |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5811736B2 (ja) | 1983-03-04 |