JPS5144265A - Denkibuhinnopurintohaisenbanheno sochakuhoho - Google Patents
Denkibuhinnopurintohaisenbanheno sochakuhohoInfo
- Publication number
- JPS5144265A JPS5144265A JP11793574A JP11793574A JPS5144265A JP S5144265 A JPS5144265 A JP S5144265A JP 11793574 A JP11793574 A JP 11793574A JP 11793574 A JP11793574 A JP 11793574A JP S5144265 A JPS5144265 A JP S5144265A
- Authority
- JP
- Japan
- Prior art keywords
- sochakuhoho
- denkibuhinnopurintohaisenbanheno
- denkibuhinnopurintohaisenbanheno sochakuhoho
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11793574A JPS5144265A (ja) | 1974-10-14 | 1974-10-14 | Denkibuhinnopurintohaisenbanheno sochakuhoho |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11793574A JPS5144265A (ja) | 1974-10-14 | 1974-10-14 | Denkibuhinnopurintohaisenbanheno sochakuhoho |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5144265A true JPS5144265A (ja) | 1976-04-15 |
Family
ID=14723840
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11793574A Pending JPS5144265A (ja) | 1974-10-14 | 1974-10-14 | Denkibuhinnopurintohaisenbanheno sochakuhoho |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5144265A (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4869123A (ja) * | 1971-12-21 | 1973-09-20 | ||
JPS5584978U (ja) * | 1978-12-04 | 1980-06-11 | ||
JP2010067965A (ja) * | 2008-09-08 | 2010-03-25 | Avx Corp | 回路基板内に埋め込むための固体電解コンデンサ |
JP2012009865A (ja) * | 2010-06-23 | 2012-01-12 | Lg Innotek Co Ltd | セラミック基板及びその製造方法並びにイメージセンサーパッケージ及びその製造方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS435498Y1 (ja) * | 1967-06-23 | 1968-03-09 |
-
1974
- 1974-10-14 JP JP11793574A patent/JPS5144265A/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS435498Y1 (ja) * | 1967-06-23 | 1968-03-09 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4869123A (ja) * | 1971-12-21 | 1973-09-20 | ||
JPS5584978U (ja) * | 1978-12-04 | 1980-06-11 | ||
JP2010067965A (ja) * | 2008-09-08 | 2010-03-25 | Avx Corp | 回路基板内に埋め込むための固体電解コンデンサ |
JP2012009865A (ja) * | 2010-06-23 | 2012-01-12 | Lg Innotek Co Ltd | セラミック基板及びその製造方法並びにイメージセンサーパッケージ及びその製造方法 |
US9337114B2 (en) | 2010-06-23 | 2016-05-10 | Lg Innotek Co., Ltd. | Ceramic board, method manufacturing thereof, image sensor package and method of manufacturing the same |
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