JPS5144064B2 - - Google Patents
Info
- Publication number
- JPS5144064B2 JPS5144064B2 JP6324772A JP6324772A JPS5144064B2 JP S5144064 B2 JPS5144064 B2 JP S5144064B2 JP 6324772 A JP6324772 A JP 6324772A JP 6324772 A JP6324772 A JP 6324772A JP S5144064 B2 JPS5144064 B2 JP S5144064B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6324772A JPS5144064B2 (hu) | 1972-06-26 | 1972-06-26 | |
| DE19732332269 DE2332269A1 (de) | 1972-06-26 | 1973-06-25 | Positioniervorrichtung fuer leiterrahmen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6324772A JPS5144064B2 (hu) | 1972-06-26 | 1972-06-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4924070A JPS4924070A (hu) | 1974-03-04 |
| JPS5144064B2 true JPS5144064B2 (hu) | 1976-11-26 |
Family
ID=13223706
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6324772A Expired JPS5144064B2 (hu) | 1972-06-26 | 1972-06-26 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS5144064B2 (hu) |
| DE (1) | DE2332269A1 (hu) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6056683A (ja) * | 1983-09-06 | 1985-04-02 | 株式会社杉原設計事務所 | バイク用駐車装置 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5160160A (ja) * | 1974-11-22 | 1976-05-25 | Hitachi Ltd | Bondeingusochi |
| JPS5192168A (hu) * | 1975-02-10 | 1976-08-12 | ||
| JPS5368076A (en) * | 1976-11-29 | 1978-06-17 | Shinkawa Seisakusho Kk | Device for carrying lead frame |
| DE2722397C2 (de) * | 1977-05-17 | 1983-06-23 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur Justierung einer Halbleiterscheibe relativ zu einer Belichtungsmaske bei der Röntgenstrahl- Fotolithografie und eine Vorrichtung zur Durchführung dieses Verfahrens |
| JPS5596647A (en) * | 1979-01-18 | 1980-07-23 | Toshiba Corp | Apparatus for positioning lead frame |
| JPS577135A (en) * | 1980-06-16 | 1982-01-14 | Mitsubishi Electric Corp | Wire bonding apparatus |
-
1972
- 1972-06-26 JP JP6324772A patent/JPS5144064B2/ja not_active Expired
-
1973
- 1973-06-25 DE DE19732332269 patent/DE2332269A1/de active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6056683A (ja) * | 1983-09-06 | 1985-04-02 | 株式会社杉原設計事務所 | バイク用駐車装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4924070A (hu) | 1974-03-04 |
| DE2332269A1 (de) | 1974-01-31 |