JPS5144064B2 - - Google Patents

Info

Publication number
JPS5144064B2
JPS5144064B2 JP6324772A JP6324772A JPS5144064B2 JP S5144064 B2 JPS5144064 B2 JP S5144064B2 JP 6324772 A JP6324772 A JP 6324772A JP 6324772 A JP6324772 A JP 6324772A JP S5144064 B2 JPS5144064 B2 JP S5144064B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP6324772A
Other languages
Japanese (ja)
Other versions
JPS4924070A (enrdf_load_html_response
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6324772A priority Critical patent/JPS5144064B2/ja
Priority to DE19732332269 priority patent/DE2332269A1/de
Publication of JPS4924070A publication Critical patent/JPS4924070A/ja
Publication of JPS5144064B2 publication Critical patent/JPS5144064B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP6324772A 1972-06-26 1972-06-26 Expired JPS5144064B2 (enrdf_load_html_response)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP6324772A JPS5144064B2 (enrdf_load_html_response) 1972-06-26 1972-06-26
DE19732332269 DE2332269A1 (de) 1972-06-26 1973-06-25 Positioniervorrichtung fuer leiterrahmen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6324772A JPS5144064B2 (enrdf_load_html_response) 1972-06-26 1972-06-26

Publications (2)

Publication Number Publication Date
JPS4924070A JPS4924070A (enrdf_load_html_response) 1974-03-04
JPS5144064B2 true JPS5144064B2 (enrdf_load_html_response) 1976-11-26

Family

ID=13223706

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6324772A Expired JPS5144064B2 (enrdf_load_html_response) 1972-06-26 1972-06-26

Country Status (2)

Country Link
JP (1) JPS5144064B2 (enrdf_load_html_response)
DE (1) DE2332269A1 (enrdf_load_html_response)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6056683A (ja) * 1983-09-06 1985-04-02 株式会社杉原設計事務所 バイク用駐車装置

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5160160A (ja) * 1974-11-22 1976-05-25 Hitachi Ltd Bondeingusochi
JPS5192168A (enrdf_load_html_response) * 1975-02-10 1976-08-12
JPS5368076A (en) * 1976-11-29 1978-06-17 Shinkawa Seisakusho Kk Device for carrying lead frame
DE2722397C2 (de) * 1977-05-17 1983-06-23 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Justierung einer Halbleiterscheibe relativ zu einer Belichtungsmaske bei der Röntgenstrahl- Fotolithografie und eine Vorrichtung zur Durchführung dieses Verfahrens
JPS5596647A (en) * 1979-01-18 1980-07-23 Toshiba Corp Apparatus for positioning lead frame
JPS577135A (en) * 1980-06-16 1982-01-14 Mitsubishi Electric Corp Wire bonding apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6056683A (ja) * 1983-09-06 1985-04-02 株式会社杉原設計事務所 バイク用駐車装置

Also Published As

Publication number Publication date
DE2332269A1 (de) 1974-01-31
JPS4924070A (enrdf_load_html_response) 1974-03-04

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