JPS5142553A - Shinsuiseishirikoonkontakutorenzuno seizohoho - Google Patents
Shinsuiseishirikoonkontakutorenzuno seizohohoInfo
- Publication number
- JPS5142553A JPS5142553A JP11603574A JP11603574A JPS5142553A JP S5142553 A JPS5142553 A JP S5142553A JP 11603574 A JP11603574 A JP 11603574A JP 11603574 A JP11603574 A JP 11603574A JP S5142553 A JPS5142553 A JP S5142553A
- Authority
- JP
- Japan
- Prior art keywords
- shinsuiseishirikoonkontakutorenzuno
- seizohoho
- shinsuiseishirikoonkontakutorenzuno seizohoho
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Silicon Polymers (AREA)
- Eyeglasses (AREA)
- Laminated Bodies (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11603574A JPS5142553A (ja) | 1974-10-08 | 1974-10-08 | Shinsuiseishirikoonkontakutorenzuno seizohoho |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11603574A JPS5142553A (ja) | 1974-10-08 | 1974-10-08 | Shinsuiseishirikoonkontakutorenzuno seizohoho |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5142553A true JPS5142553A (ja) | 1976-04-10 |
Family
ID=14677119
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11603574A Pending JPS5142553A (ja) | 1974-10-08 | 1974-10-08 | Shinsuiseishirikoonkontakutorenzuno seizohoho |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5142553A (ja) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5456664A (en) * | 1977-09-21 | 1979-05-07 | American Optical Corp | Casting method of contact lens |
JPH02278224A (ja) * | 1989-04-20 | 1990-11-14 | Seiko Epson Corp | コンタクトレンズ |
US4980208A (en) * | 1989-06-14 | 1990-12-25 | Menicon Company, Ltd. | Method for treating the surface of an oxygen permeable hard contact lens |
JPH03288816A (ja) * | 1990-04-05 | 1991-12-19 | Seiko Epson Corp | コンタクトレンズの製造方法 |
JPH05170955A (ja) * | 1992-04-27 | 1993-07-09 | Toray Ind Inc | フッ素含有有機ポリシロキサン系光学物品 |
JP2003517503A (ja) * | 2000-05-12 | 2003-05-27 | ボシュ・アンド・ロム・インコーポレイテッド | 可撓性カーボンコーティングを有するシリコーンヒドロゲルコンタクトレンズのプラズマ表面処理 |
JP2014196386A (ja) * | 2013-03-29 | 2014-10-16 | 東海ゴム工業株式会社 | 表面改質部材およびその製造方法、並びにマイクロ流路装置およびその製造方法 |
WO2019064871A1 (ja) * | 2017-09-27 | 2019-04-04 | 株式会社 東芝 | 構造体、配線基板、配線基板用基材、銅張積層板及び構造体の製造方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4874580A (ja) * | 1971-12-31 | 1973-10-08 |
-
1974
- 1974-10-08 JP JP11603574A patent/JPS5142553A/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4874580A (ja) * | 1971-12-31 | 1973-10-08 |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5456664A (en) * | 1977-09-21 | 1979-05-07 | American Optical Corp | Casting method of contact lens |
JPS6155453B2 (ja) * | 1977-09-21 | 1986-11-27 | Ao Inc | |
JPH02278224A (ja) * | 1989-04-20 | 1990-11-14 | Seiko Epson Corp | コンタクトレンズ |
US4980208A (en) * | 1989-06-14 | 1990-12-25 | Menicon Company, Ltd. | Method for treating the surface of an oxygen permeable hard contact lens |
JPH03288816A (ja) * | 1990-04-05 | 1991-12-19 | Seiko Epson Corp | コンタクトレンズの製造方法 |
JPH05170955A (ja) * | 1992-04-27 | 1993-07-09 | Toray Ind Inc | フッ素含有有機ポリシロキサン系光学物品 |
JP2003517503A (ja) * | 2000-05-12 | 2003-05-27 | ボシュ・アンド・ロム・インコーポレイテッド | 可撓性カーボンコーティングを有するシリコーンヒドロゲルコンタクトレンズのプラズマ表面処理 |
JP2014196386A (ja) * | 2013-03-29 | 2014-10-16 | 東海ゴム工業株式会社 | 表面改質部材およびその製造方法、並びにマイクロ流路装置およびその製造方法 |
WO2019064871A1 (ja) * | 2017-09-27 | 2019-04-04 | 株式会社 東芝 | 構造体、配線基板、配線基板用基材、銅張積層板及び構造体の製造方法 |
JP2019059151A (ja) * | 2017-09-27 | 2019-04-18 | 株式会社東芝 | 構造体、配線基板、配線基板用基材、銅張積層板及び構造体の製造方法 |
CN111093985A (zh) * | 2017-09-27 | 2020-05-01 | 株式会社东芝 | 结构体、布线基板、布线基板用基材、覆铜叠层板及结构体的制造方法 |
US10912193B2 (en) | 2017-09-27 | 2021-02-02 | Kabushiki Kaisha Toshiba | Structure, wiring board, substrate for wiring board, copper clad laminate, and method for manufacturing the structure |
EP3689597A4 (en) * | 2017-09-27 | 2021-06-16 | Kabushiki Kaisha Toshiba | STRUCTURE, CIRCUIT BOARD, BASE MATERIAL FOR CIRCUIT BOARDS, COPPER-LAMINATED LAMINATE AND METHOD FOR MANUFACTURING THE STRUCTURE |
CN111093985B (zh) * | 2017-09-27 | 2022-11-01 | 株式会社东芝 | 结构体、布线基板、布线基板用基材、覆铜叠层板及结构体的制造方法 |
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