JPS5142276Y2 - - Google Patents

Info

Publication number
JPS5142276Y2
JPS5142276Y2 JP1972006766U JP676672U JPS5142276Y2 JP S5142276 Y2 JPS5142276 Y2 JP S5142276Y2 JP 1972006766 U JP1972006766 U JP 1972006766U JP 676672 U JP676672 U JP 676672U JP S5142276 Y2 JPS5142276 Y2 JP S5142276Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1972006766U
Other languages
Japanese (ja)
Other versions
JPS4883758U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1972006766U priority Critical patent/JPS5142276Y2/ja
Publication of JPS4883758U publication Critical patent/JPS4883758U/ja
Application granted granted Critical
Publication of JPS5142276Y2 publication Critical patent/JPS5142276Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/39Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L24/40Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H01L2224/37001Core members of the connector
    • H01L2224/3701Shape
    • H01L2224/37011Shape comprising apertures or cavities
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1972006766U 1972-01-14 1972-01-14 Expired JPS5142276Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1972006766U JPS5142276Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1972-01-14 1972-01-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1972006766U JPS5142276Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1972-01-14 1972-01-14

Publications (2)

Publication Number Publication Date
JPS4883758U JPS4883758U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1973-10-12
JPS5142276Y2 true JPS5142276Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1976-10-14

Family

ID=27848686

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1972006766U Expired JPS5142276Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1972-01-14 1972-01-14

Country Status (1)

Country Link
JP (1) JPS5142276Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Also Published As

Publication number Publication date
JPS4883758U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1973-10-12

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