JPS5139466U - - Google Patents

Info

Publication number
JPS5139466U
JPS5139466U JP11239274U JP11239274U JPS5139466U JP S5139466 U JPS5139466 U JP S5139466U JP 11239274 U JP11239274 U JP 11239274U JP 11239274 U JP11239274 U JP 11239274U JP S5139466 U JPS5139466 U JP S5139466U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11239274U
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11239274U priority Critical patent/JPS5139466U/ja
Publication of JPS5139466U publication Critical patent/JPS5139466U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
JP11239274U 1974-09-18 1974-09-18 Pending JPS5139466U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11239274U JPS5139466U (ja) 1974-09-18 1974-09-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11239274U JPS5139466U (ja) 1974-09-18 1974-09-18

Publications (1)

Publication Number Publication Date
JPS5139466U true JPS5139466U (ja) 1976-03-24

Family

ID=28339125

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11239274U Pending JPS5139466U (ja) 1974-09-18 1974-09-18

Country Status (1)

Country Link
JP (1) JPS5139466U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5374368A (en) * 1976-12-15 1978-07-01 Hitachi Ltd Package for semiconductor device
JPS5492168U (ja) * 1977-12-13 1979-06-29

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5374368A (en) * 1976-12-15 1978-07-01 Hitachi Ltd Package for semiconductor device
JPS5492168U (ja) * 1977-12-13 1979-06-29

Similar Documents

Publication Publication Date Title
BR7501663A (ja)
AU7459374A (ja)
JPS5139466U (ja)
AU495028B2 (ja)
CH1584874A4 (ja)
AU480625A (ja)
AU480143A (ja)
CH1703874A4 (ja)
BE829576A (ja)
BE833391A (ja)
BG19629A1 (ja)
CH467775A4 (ja)
BG19667A1 (ja)
BG19896A1 (ja)
BG19982A1 (ja)
BG20022A1 (ja)
BG20237A1 (ja)
BG20425A1 (ja)
BG20446A1 (ja)
BG20857A1 (ja)
BG21135A1 (ja)
BG21493A1 (ja)
BG21814A1 (ja)
BG22015A1 (ja)
BG22275A1 (ja)