JPS5137869B2 - - Google Patents
Info
- Publication number
- JPS5137869B2 JPS5137869B2 JP10538571A JP10538571A JPS5137869B2 JP S5137869 B2 JPS5137869 B2 JP S5137869B2 JP 10538571 A JP10538571 A JP 10538571A JP 10538571 A JP10538571 A JP 10538571A JP S5137869 B2 JPS5137869 B2 JP S5137869B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10538571A JPS5137869B2 (en:Method) | 1971-12-27 | 1971-12-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10538571A JPS5137869B2 (en:Method) | 1971-12-27 | 1971-12-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4871579A JPS4871579A (en:Method) | 1973-09-27 |
| JPS5137869B2 true JPS5137869B2 (en:Method) | 1976-10-18 |
Family
ID=14406185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10538571A Expired JPS5137869B2 (en:Method) | 1971-12-27 | 1971-12-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5137869B2 (en:Method) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5255168U (en:Method) * | 1975-10-16 | 1977-04-21 | ||
| JPS5384277U (en:Method) * | 1976-12-14 | 1978-07-12 | ||
| JPS58133939U (ja) * | 1982-03-03 | 1983-09-09 | 富士通株式会社 | 半導体部品用放熱板 |
-
1971
- 1971-12-27 JP JP10538571A patent/JPS5137869B2/ja not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5255168U (en:Method) * | 1975-10-16 | 1977-04-21 | ||
| JPS5384277U (en:Method) * | 1976-12-14 | 1978-07-12 | ||
| JPS58133939U (ja) * | 1982-03-03 | 1983-09-09 | 富士通株式会社 | 半導体部品用放熱板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4871579A (en:Method) | 1973-09-27 |