JPS5136121Y2 - - Google Patents

Info

Publication number
JPS5136121Y2
JPS5136121Y2 JP1971011223U JP1122371U JPS5136121Y2 JP S5136121 Y2 JPS5136121 Y2 JP S5136121Y2 JP 1971011223 U JP1971011223 U JP 1971011223U JP 1122371 U JP1122371 U JP 1122371U JP S5136121 Y2 JPS5136121 Y2 JP S5136121Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1971011223U
Other versions
JPS4719667U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1971011223U priority Critical patent/JPS5136121Y2/ja
Publication of JPS4719667U publication Critical patent/JPS4719667U/ja
Application granted granted Critical
Publication of JPS5136121Y2 publication Critical patent/JPS5136121Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Snaps, Bayonet Connections, Set Pins, And Snap Rings (AREA)
  • Wire Bonding (AREA)
JP1971011223U 1971-02-18 1971-02-18 Expired JPS5136121Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1971011223U JPS5136121Y2 (ja) 1971-02-18 1971-02-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1971011223U JPS5136121Y2 (ja) 1971-02-18 1971-02-18

Publications (2)

Publication Number Publication Date
JPS4719667U JPS4719667U (ja) 1972-11-06
JPS5136121Y2 true JPS5136121Y2 (ja) 1976-09-04

Family

ID=27856869

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1971011223U Expired JPS5136121Y2 (ja) 1971-02-18 1971-02-18

Country Status (1)

Country Link
JP (1) JPS5136121Y2 (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4523053Y1 (ja) * 1966-08-29 1970-09-11
JPS4527160Y1 (ja) * 1964-08-12 1970-10-21

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4527160Y1 (ja) * 1964-08-12 1970-10-21
JPS4523053Y1 (ja) * 1966-08-29 1970-09-11

Also Published As

Publication number Publication date
JPS4719667U (ja) 1972-11-06

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