JPS5131723A - SETSUCHAKUSEINOKAIZENSARETA MIZUGARASUSOSEIBUTSU - Google Patents
SETSUCHAKUSEINOKAIZENSARETA MIZUGARASUSOSEIBUTSUInfo
- Publication number
- JPS5131723A JPS5131723A JP10489474A JP10489474A JPS5131723A JP S5131723 A JPS5131723 A JP S5131723A JP 10489474 A JP10489474 A JP 10489474A JP 10489474 A JP10489474 A JP 10489474A JP S5131723 A JPS5131723 A JP S5131723A
- Authority
- JP
- Japan
- Prior art keywords
- setsuchakuseinokaizensareta
- mizugarasusoseibutsu
- setsuchakuseinokaizensareta mizugarasusoseibutsu
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Laminated Bodies (AREA)
- Silicates, Zeolites, And Molecular Sieves (AREA)
- Curing Cements, Concrete, And Artificial Stone (AREA)
- Adhesives Or Adhesive Processes (AREA)
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10489474A JPS5131723A (en) | 1974-09-13 | 1974-09-13 | SETSUCHAKUSEINOKAIZENSARETA MIZUGARASUSOSEIBUTSU |
US05/612,448 US4018616A (en) | 1974-09-13 | 1975-09-11 | Water glass composition |
GB37618/75A GB1503187A (en) | 1974-09-13 | 1975-09-12 | Water glass composition |
CA235,345A CA1058354A (en) | 1974-09-13 | 1975-09-12 | Water glass composition |
DE2540756A DE2540756C2 (en) | 1974-09-13 | 1975-09-12 | Use of an inorganic phosphate compound for hardening a water-soluble or water-dispersible silicate binder |
FR7528213A FR2284577A1 (en) | 1974-09-13 | 1975-09-15 | COMPOSITION OF SOLUBLE GLASS |
NL7510833A NL7510833A (en) | 1974-09-13 | 1975-09-15 | PROCESS FOR PREPARING A WATERGLASS COMPOSITION. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10489474A JPS5131723A (en) | 1974-09-13 | 1974-09-13 | SETSUCHAKUSEINOKAIZENSARETA MIZUGARASUSOSEIBUTSU |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5131723A true JPS5131723A (en) | 1976-03-18 |
JPS5324212B2 JPS5324212B2 (en) | 1978-07-19 |
Family
ID=14392856
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10489474A Granted JPS5131723A (en) | 1974-09-13 | 1974-09-13 | SETSUCHAKUSEINOKAIZENSARETA MIZUGARASUSOSEIBUTSU |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5131723A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52117320A (en) * | 1976-03-24 | 1977-10-01 | Bayer Ag | Aqueous solution of alkali silicate and alkali biphosphate |
JPH03140383A (en) * | 1989-10-27 | 1991-06-14 | Tomoaki Murata | Inorganic heat-and hot water-resistant adhesive |
WO2008117611A1 (en) * | 2007-03-26 | 2008-10-02 | Ngk Insulators, Ltd. | Bonding material composition, process for producing the same, and bonded material and process for producing the same |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102015216619B4 (en) | 2015-08-31 | 2017-08-10 | Disco Corporation | Method for processing a wafer |
WO2017036512A1 (en) | 2015-08-31 | 2017-03-09 | Karl Heinz Priewasser | Method of processing wafer and protective sheeting for use in this method |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4880636A (en) * | 1972-02-04 | 1973-10-29 |
-
1974
- 1974-09-13 JP JP10489474A patent/JPS5131723A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4880636A (en) * | 1972-02-04 | 1973-10-29 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52117320A (en) * | 1976-03-24 | 1977-10-01 | Bayer Ag | Aqueous solution of alkali silicate and alkali biphosphate |
JPS5637187B2 (en) * | 1976-03-24 | 1981-08-29 | ||
JPH03140383A (en) * | 1989-10-27 | 1991-06-14 | Tomoaki Murata | Inorganic heat-and hot water-resistant adhesive |
WO2008117611A1 (en) * | 2007-03-26 | 2008-10-02 | Ngk Insulators, Ltd. | Bonding material composition, process for producing the same, and bonded material and process for producing the same |
Also Published As
Publication number | Publication date |
---|---|
JPS5324212B2 (en) | 1978-07-19 |
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