JPS5130933Y2 - - Google Patents

Info

Publication number
JPS5130933Y2
JPS5130933Y2 JP1971097909U JP9790971U JPS5130933Y2 JP S5130933 Y2 JPS5130933 Y2 JP S5130933Y2 JP 1971097909 U JP1971097909 U JP 1971097909U JP 9790971 U JP9790971 U JP 9790971U JP S5130933 Y2 JPS5130933 Y2 JP S5130933Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1971097909U
Other languages
Japanese (ja)
Other versions
JPS4853260U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1971097909U priority Critical patent/JPS5130933Y2/ja
Publication of JPS4853260U publication Critical patent/JPS4853260U/ja
Application granted granted Critical
Publication of JPS5130933Y2 publication Critical patent/JPS5130933Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP1971097909U 1971-10-21 1971-10-21 Expired JPS5130933Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1971097909U JPS5130933Y2 (enExample) 1971-10-21 1971-10-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1971097909U JPS5130933Y2 (enExample) 1971-10-21 1971-10-21

Publications (2)

Publication Number Publication Date
JPS4853260U JPS4853260U (enExample) 1973-07-10
JPS5130933Y2 true JPS5130933Y2 (enExample) 1976-08-03

Family

ID=28011148

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1971097909U Expired JPS5130933Y2 (enExample) 1971-10-21 1971-10-21

Country Status (1)

Country Link
JP (1) JPS5130933Y2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS579232B2 (enExample) * 1973-03-13 1982-02-20
JPS51115784A (en) * 1975-03-26 1976-10-12 Hitachi Ltd Photo coupling semiconductor apparatus
JPS5832514B2 (ja) * 1975-04-22 1983-07-13 三菱電機株式会社 ハンドウタイヒカリケツゴウソシ
JPS5832515B2 (ja) * 1975-04-30 1983-07-13 三菱電機株式会社 ハンドウタイヒカリケツゴウソシ

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4122277Y1 (enExample) * 1964-08-19 1966-11-07

Also Published As

Publication number Publication date
JPS4853260U (enExample) 1973-07-10

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