JPS5130933Y2 - - Google Patents

Info

Publication number
JPS5130933Y2
JPS5130933Y2 JP1971097909U JP9790971U JPS5130933Y2 JP S5130933 Y2 JPS5130933 Y2 JP S5130933Y2 JP 1971097909 U JP1971097909 U JP 1971097909U JP 9790971 U JP9790971 U JP 9790971U JP S5130933 Y2 JPS5130933 Y2 JP S5130933Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1971097909U
Other languages
Japanese (ja)
Other versions
JPS4853260U (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1971097909U priority Critical patent/JPS5130933Y2/ja
Publication of JPS4853260U publication Critical patent/JPS4853260U/ja
Application granted granted Critical
Publication of JPS5130933Y2 publication Critical patent/JPS5130933Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP1971097909U 1971-10-21 1971-10-21 Expired JPS5130933Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1971097909U JPS5130933Y2 (enrdf_load_stackoverflow) 1971-10-21 1971-10-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1971097909U JPS5130933Y2 (enrdf_load_stackoverflow) 1971-10-21 1971-10-21

Publications (2)

Publication Number Publication Date
JPS4853260U JPS4853260U (enrdf_load_stackoverflow) 1973-07-10
JPS5130933Y2 true JPS5130933Y2 (enrdf_load_stackoverflow) 1976-08-03

Family

ID=28011148

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1971097909U Expired JPS5130933Y2 (enrdf_load_stackoverflow) 1971-10-21 1971-10-21

Country Status (1)

Country Link
JP (1) JPS5130933Y2 (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS579232B2 (enrdf_load_stackoverflow) * 1973-03-13 1982-02-20
JPS51115784A (en) * 1975-03-26 1976-10-12 Hitachi Ltd Photo coupling semiconductor apparatus
JPS5832514B2 (ja) * 1975-04-22 1983-07-13 三菱電機株式会社 ハンドウタイヒカリケツゴウソシ
JPS5832515B2 (ja) * 1975-04-30 1983-07-13 三菱電機株式会社 ハンドウタイヒカリケツゴウソシ

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4122277Y1 (enrdf_load_stackoverflow) * 1964-08-19 1966-11-07

Also Published As

Publication number Publication date
JPS4853260U (enrdf_load_stackoverflow) 1973-07-10

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