JPS5130923Y2 - - Google Patents
Info
- Publication number
- JPS5130923Y2 JPS5130923Y2 JP1972022003U JP2200372U JPS5130923Y2 JP S5130923 Y2 JPS5130923 Y2 JP S5130923Y2 JP 1972022003 U JP1972022003 U JP 1972022003U JP 2200372 U JP2200372 U JP 2200372U JP S5130923 Y2 JPS5130923 Y2 JP S5130923Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1972022003U JPS5130923Y2 (enExample) | 1972-02-22 | 1972-02-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1972022003U JPS5130923Y2 (enExample) | 1972-02-22 | 1972-02-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4896864U JPS4896864U (enExample) | 1973-11-16 |
| JPS5130923Y2 true JPS5130923Y2 (enExample) | 1976-08-03 |
Family
ID=27876962
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1972022003U Expired JPS5130923Y2 (enExample) | 1972-02-22 | 1972-02-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5130923Y2 (enExample) |
-
1972
- 1972-02-22 JP JP1972022003U patent/JPS5130923Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4896864U (enExample) | 1973-11-16 |