JPS5129701B1 - - Google Patents
Info
- Publication number
- JPS5129701B1 JPS5129701B1 JP47104038A JP10403872A JPS5129701B1 JP S5129701 B1 JPS5129701 B1 JP S5129701B1 JP 47104038 A JP47104038 A JP 47104038A JP 10403872 A JP10403872 A JP 10403872A JP S5129701 B1 JPS5129701 B1 JP S5129701B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US75225068A | 1968-08-13 | 1968-08-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5129701B1 true JPS5129701B1 (en) | 1976-08-27 |
Family
ID=25025526
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP47104038A Pending JPS5129701B1 (en) | 1968-08-13 | 1972-10-19 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US3615735A (en) |
| JP (1) | JPS5129701B1 (en) |
| DE (1) | DE1966198C3 (en) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3765936A (en) * | 1968-08-13 | 1973-10-16 | Shipley Co | Electroless copper plate |
| US4167601A (en) * | 1976-11-15 | 1979-09-11 | Western Electric Company, Inc. | Method of depositing a stress-free electroless copper deposit |
| US4265943A (en) * | 1978-11-27 | 1981-05-05 | Macdermid Incorporated | Method and composition for continuous electroless copper deposition using a hypophosphite reducing agent in the presence of cobalt or nickel ions |
| US4228213A (en) * | 1979-08-13 | 1980-10-14 | Western Electric Company, Inc. | Method of depositing a stress-free electroless copper deposit |
| DE3404270A1 (en) * | 1984-02-04 | 1985-08-08 | Schering AG, 1000 Berlin und 4709 Bergkamen | AQUEOUS ALKALINE BATH FOR CHEMICAL DEPOSITION OF COPPER, NICKEL, COBALT AND THEIR ALLOYS |
| US5077099B1 (en) * | 1990-03-14 | 1997-12-02 | Macdermid Inc | Electroless copper plating process and apparatus |
| JP3115095B2 (en) * | 1992-04-20 | 2000-12-04 | ディップソール株式会社 | Electroless plating solution and plating method using the same |
| US5258200A (en) * | 1992-08-04 | 1993-11-02 | Amp-Akzo Corporation | Electroless copper deposition |
| US5256441A (en) * | 1992-08-04 | 1993-10-26 | Amp-Akzo Corporation | Ductile copper |
| JP3058063B2 (en) * | 1995-10-18 | 2000-07-04 | 株式会社村田製作所 | Activating catalyst solution for electroless plating and electroless plating method |
| EP1020543A1 (en) * | 1999-01-15 | 2000-07-19 | Interuniversitair Micro-Elektronica Centrum Vzw | Deposition of copper on an activated surface of a substrate |
| WO2004101847A1 (en) * | 2003-05-14 | 2004-11-25 | Century Circuits Inc. | Method and apparatus for converting metal ion in solution to the metal state |
| US20050067297A1 (en) * | 2003-09-26 | 2005-03-31 | Innovative Technology Licensing, Llc | Copper bath for electroplating fine circuitry on semiconductor chips |
| US9153449B2 (en) | 2012-03-19 | 2015-10-06 | Lam Research Corporation | Electroless gap fill |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3093509A (en) * | 1959-09-28 | 1963-06-11 | Wein Samuel | Process for making copper films |
| US3134690A (en) * | 1960-02-09 | 1964-05-26 | Eriksson Lars Erik | Method for deposition of a copper layer on a non-conductive material |
| DE1287885B (en) * | 1964-05-27 | |||
| US3329512A (en) * | 1966-04-04 | 1967-07-04 | Shipley Co | Chemical deposition of copper and solutions therefor |
| US3475186A (en) * | 1968-01-05 | 1969-10-28 | Shipley Co | Electroless copper plating |
-
1968
- 1968-08-13 US US752250A patent/US3615735A/en not_active Expired - Lifetime
-
1969
- 1969-08-09 DE DE1966198A patent/DE1966198C3/en not_active Expired
-
1972
- 1972-10-19 JP JP47104038A patent/JPS5129701B1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US3615735A (en) | 1971-10-26 |
| DE1966198C3 (en) | 1979-03-15 |
| DE1966198B2 (en) | 1978-07-13 |
| DE1966198A1 (en) | 1971-11-11 |